Strap assembly comprising functional block deposited therein and method of making same

ABSTRACT

Methods and apparatuses for an electronic assembly. The method comprises depositing a functional block into a recessed region, forming dielectric layer selectively over at least one of a selected portion of the functional block and a selected portion of the first substrate; and forming one or more electrical interconnections to the functional block. The recessed region is formed on a first substrate. The depositing of the functional block occurs on a continuous web line and using a Fluidic Self Assembly process. The functional block has a width-depth aspect ratio that substantially matches a width-depth aspect ratio of said recessed region which is one of equal to or less than 10.5:1, and equal to or less than 7.5:1.

RELATED APPLICATIONS

This application is a divisional of co-pending U.S. patent applicationSer. No. 11/159,550, filed on Jun. 22, 2005, which is also related toand claims the benefit of U.S. Provisional Patent Application No.60/626,241 filed Nov. 8, 2004, which is hereby incorporated by referencein its entirety. This application is also related to co-pending U.S.patent application Ser. Nos. 11/159,526 and 11/159,574 filed on the sameday with this application, Jun. 22, 2005, which have attorney docketnumbers 03424.P075 and 03424.P076 and which are hereby incorporated byreference in their entireties.

FIELD

The present invention relates generally to the field of fabricatingelectronic devices with small functional elements deposited in asubstrate.

BACKGROUND

There are many examples of functional blocks or components that canprovide, produce, or detect electromagnetic or electronic signals orother characteristics. The functional blocks are typically objects,microstructures, or microelements with integrated circuits built thereinor thereon. These functional blocks have many applications and uses. Thefunctional components can be used as an array of display drivers in adisplay where many pixels or sub-pixels are formed with an array ofelectronic elements. For example, an active matrix liquid crystaldisplay includes an array of many pixels or sub-pixels which arefabricated using amorphous silicon or polysilicon circuit elements.Additionally, a billboard display or a signage display such as storedisplays and airport signs are also among the many electronic devicesemploying these functional components.

Functional components have also been used to make other electronicdevices. One example of such use is that of a radio frequency (RF)identification tag (RFID tag) which contains a functional block orseveral blocks each having a necessary circuit element. Information isrecorded into these blocks, which is then transferred to a base station.Typically, this is accomplished as the RFID tag, in response to a codedRF signal received from the base station, functions to cause the RFIDtag to reflect the incident RF carrier back to the base station therebytransferring the information. Such RFID tags are being incorporated intomany commercial items for uses such as tracking and authenticating theitems.

The functional components may also be incorporated into substrates tomake displays such as flat panel displays, liquid crystal displays(LCDs), active matrix LCDs, and passive matrix LCDs. Making LCDs hasbecome increasingly difficult because it is challenging to produce LCDswith high yields. Furthermore, the packaging of driver circuits hasbecome increasingly difficult as the resolution of the LCD increases.The packaged driver elements are also relatively large and occupyvaluable space in a product, which results in larger and heavierproducts.

Demand for functional components has expanded dramatically. Clearly, thefunctional components have been applied to make many electronic devices,for instance, the making of microprocessors, memories, powertransistors, super capacitors, displays, x-ray detector panels, solarcell arrays, memory arrays, long wavelength detector arrays, phasedarray antennas, RFID tags, chemical sensors, electromagnetic radiationsensors, thermal sensors, pressure sensors, or the like. The growth forthe use of functional components, however, has been inhibited by thehigh cost of assembling the functional components into substrates andfabricating final devices or end products that incorporate thefunctional components.

Often the assembling of these components requires complex and multipleprocesses thereby causing the price of the end product to be expensive.Furthermore, the manufacturing of these components is costly under thecurrent method because of inefficient and wasteful uses of thetechnologies and the materials used to make these products.

Many aspects such as substrates' materials, characteristics, dimensions,and/or functional blocks' dimensions and characteristics, and the like,impact the efficiency and cost of assembling the functional componentsinto substrates. Accurate dimension and parameter control of theseaspects are crucial for efficiency while reducing cost for assemblingelectronic devices containing functional blocks deposited therein.

SUMMARY

Embodiments of the present invention provide methods that can lead toefficient fabrications of an electronic assembly that incorporates afunctional component or block.

In one aspect of the invention, a strap assembly is fabricated. One ormore recessed receptor sites (regions) are formed into a strapsubstrate. One or more functional or integrated circuit blocks aredeposited into the recessed receptor sites, for example, using a FluidicSelf-Assembly (FSA) process. Electrical interconnections are created toenable connection to the functional blocks. After the functional blocksare deposited into the respective receptor sites in the strap substrateand the necessary interconnections formed, the strap assembly is thenattached to another substrate, which may comprise a set of patterned orprinted conductor (e.g., elements or parts of an antenna for an RFIDdevice).

To form the electrical interconnections, in one embodiment, a localprinting method coupled with a guidance system is used to increase theresolution of the interconnections. A print head is used for the localprinting method. One or more electrical contacts to the functionalblocks can be made using this local printing method. The guidance systemcan be an optical system that recognizes features on the strap substrateto provide alignment of a print head. An electrical, magnetic, ormechanical mechanism can also be used to provide improved alignment aswell. The local printing method includes thermal jet printing,piezoelectric jet printing, acoustic jet printing, extrusion of amaterial (stencil printing), or other printing methods. It should berecognized that it is possible to group multiple local printing methodswith multiple print heads, with each print head depositing a printedmaterial, so that more than one region of a substrate can be printed onat the same time.

In another aspect of the invention, the guidance system is used toimprove the registration of the printing of the interconnections of thestrap substrate. In another aspect of the invention, a combination oflocal printing, laser cutting, and a guidance system are used to repairbad circuit elements in the strap substrate.

In another aspect, a testing method, which could comprise an optical,electrical, or mechanical means, is used to determine areas of the strapsubstrate in which a portion of the functional blocks are known to be,or suspected to be, faulty. A laser can be used to cut, deplete, orotherwise render the damaged area ready for a subsequent printing ordeposition step, including the deposition of another integrated circuitelement.

In another aspect of the invention, a printing method with a guidancesystem is used to deposit a dielectric (non-conductive) material overselected areas of the functional block and/or the strap substrate. Thedielectric material functions as an insulation as well as used to tackdown, trap, or adhere the functional block that is within a recessedreceptor region and/or the integrated circuit on the block. Furtherprocessing of the strap substrate and final device can then be performedwith minimal risk of the integrated circuit or functional block becomingdetached from the substrate.

One aspect of the invention pertains to a method that comprisesdepositing a functional block into a recessed region; forming adielectric layer selectively over a selected portion or selectedportions of the functional block and the first substrate; and formingone or more electrical interconnections to the functional block. Therecessed region is formed on a first substrate. Depositing the blocksoccurs on a continuous web line and using a Fluidic Self Assemblyprocess. The functional block has a width-depth aspect ratio thatsubstantially matches a width-depth aspect ratio of the recessed region,which is equal to or less than 10.5:1. Alternatively, the width-depthaspect ratio of the recessed region is equal to or less than 7.5:1.

One aspect of the invention pertains to a method that comprisesdepositing a functional block onto a web substrate using a Fluidic SelfAssembly process; using a direct writing process to form a dielectriclayer over the functional block and the web substrate at selected areas;and forming one or more interconnects to the functional block. The websubstrate has a recessed region configured to receive the functionalblock. In one embodiment, depositing the functional block, forming thedielectric layer, and forming the interconnects all occur on a samemachine.

One aspect of the invention pertains to a processing system used forassemble functional blocks into a strap substrate. The processing systemcomprises a web-processing line configured to move a roll of substratematerial across one or more processing stations; a Fluidic Self-Assemblydevice configured to deposit a functional into a recessed region formedin the substrate material; a first direct write device configured toformed interconnection features to and from the functional block; and asecond direct write device configured to selectively form a dielectriclayer over the functional block and the substrate material. The systemmay further comprise a vibration device positioned to exert avibrational force on one or both of the substrate material and a slurrythat is dispensed via the FSA device to dispense the functional blockonto the substrate material. The vibration device facilitates depositionof functional block. The system may further comprise an embossing deviceconfigured to create the recessed region into the substrate material.Additionally, a computer system may be included and which is set up tocontrol the web-processing line, the FSA device, the first directwriting device, and/or the second direct writing device, and otherdevices associated with the processing system.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be understood more fully from the detaileddescription given below and from the accompanying drawings of variousembodiments of the invention, which, however, should not be taken tolimit the invention to the specific embodiments, but are for explanationand understanding only. In the drawings:

FIG. 1 illustrates an example of a functional component block;

FIG. 2A illustrates an exemplary embodiment of an electronic assemblywith a functional block deposited in a substrate;

FIGS. 2B-2C illustrate exemplary embodiments of a via formed in adielectric layer that is formed over a functional block;

FIGS. 2D, 2E(a)-2E(b) and 2F illustrate exemplary embodiments of aconductive interconnect coupling to a functional block;

FIG. 2G illustrates an exemplary embodiment of incorporating theassembly formed in FIG. 2A to a second substrate (a device substrate);

FIG. 3 illustrates an exemplary embodiment of an electronic assemblywith a functional block deposited in a substrate that is a multi-layeredsubstrate;

FIGS. 4-5 illustrate aspects of a recessed region formed in a substrate

FIG. 6A illustrates an exemplary embodiment of an electronic assemblywith multiple functional blocks deposited in a substrate with aplurality of recessed regions;

FIG. 6B illustrates an exemplary embodiment of an electronic assemblywith multiple functional blocks deposited in a substrate with thefunctional blocks being recessed below a surface of the substrate;

FIGS. 7A-7D illustrate an exemplary embodiment that uses a template tocreate recessed regions in a substrate;

FIGS. 7E-7F illustrate non-uniform or inconsistent step-changes betweenframes of substrate;

FIGS. 7G-7H illustrate an exemplary embodiment of the present inventionwith consistent step-changes between frames of substrate;

FIGS. 7I-7M illustrate an exemplary embodiment that uses a roller withfeatures to create recessed regions in a substrate;

FIG. 8 illustrates an exemplary embodiment of an overall process ofmaking an electronic assembly with functional block in accordance toembodiments of the present invention;

FIG. 9 illustrates another exemplary embodiment of an overall process ofmaking an electronic assembly with functional block in accordance toembodiments of the present invention;

FIGS. 10-11 illustrate a plurality of sheets being joined together toform a long sheet of substrate with recessed regions in accordance withembodiments of the present invention;

FIG. 12 illustrates an exemplary embodiment of an overall process ofmaking an electronic assembly with functional block in accordance toembodiments of the present invention;

FIGS. 13, 14A-14B, and 15 illustrate exemplary methods of making anelectronic assembly with functional block in accordance to embodimentsof the present invention;

FIGS. 16-17, 18A-18B, and 19A-19C illustrate exemplary methods of makingan electronic assembly with functional block incorporating directwriting technique in accordance to embodiments of the present invention;

FIGS. 20-24 illustrate exemplary electronic assemblies formed inaccordance to methods of the present invention; and

FIG. 25 illustrates an exemplary processing system that can be used withsome embodiments of the present invention.

DETAILED DESCRIPTION

In the following description, for purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of the invention. It will be apparent to one skilled inthe art, however, that the invention can be practiced without thesespecific details. In other instances, structures and devices are shownin block diagram form to avoid obscuring the invention.

Embodiments of the present invention relate to methods for formingholes, openings, or recessed regions in a substrate or web substrate anddepositing functional blocks into the recessed regions, forming layers,and/or electrical interconnections to the blocks to form electronicassemblies. On many occasions, the disclosure refers to the substratewith one or more functional blocks deposited therein as a “strapassembly.” Electronic devices that can be formed using embodimentsinclude a display, a smart card, a sensor, an electronic tag, an RFIDtag, etc. Some embodiments of the present invention also relate tocharacteristics and features of the substrates or the substratematerials that the functional blocks are deposited therein. Someembodiments of the present invention also relate to feature dimensionsand specifics of the functional blocks with respect to the substrate andthe recessed regions.

Embodiments of the invention apply to both flexible and rigidsubstrates, and to both monolayer and multilayer substrates. By creatingrecessed regions in a substrate, the substrate is able to receive afunctional block or functional blocks that may have a circuit elementthereon. In some embodiments, the substrate includes one functionalblock. In many embodiments, the substrate includes a plurality of suchrecessed regions for a plurality of such functional blocks. Typicallythe blocks are contained in a slurry, which is deposited onto theflexible substrate as is typically done in a Fluidic Self-Assembly (FSA)process. Although the blocks may be comprised of single crystal siliconor other like material, which makes the block rigid, the substrate maystill be flexible because the size of these blocks (e.g., 650×500 μm or850×850 μm) is small, or significantly small, in comparison to theflexible substrate (e.g., 3×6 mm or larger). In some embodiments, theflexible substrate forms part of an RFID tag, a merchandise label, apackaging, a pharmaceutical label/seal, a currency (money), or a displaybackplane, to name a few example applications.

Many devices are made from a combination of a strap substrate andanother substrate (or a receiving substrate or a device substrate). Suchdevices may include an RFID tags, a display, a smart card, a sensor, anelectronic tag, or a sensor device. A device with a strap substratecombined to another substrate are described in U.S. Pat. No. 6,606,247,which is hereby incorporated herein by reference. In one example of thiscombination, the strap substrate is fabricated with one or more recessedreceptor sites, and one or more functional or integrated circuit blocksare deposited into the recessed receptor sites, for example, using aFluidic Self-Assembly (FSA) process. The functional blocks may bedeposited by one or more FSA operations, by robotic pick-and-placeoperations, or by other methods. After a functional block is depositedinto the corresponding strap substrate, the strap substrate is thenattached to another substrate, which may comprise a set of patterned orprinted conductor. The conductor can be an electrical element of adevice; for instance, the conductor can be elements or parts of anantenna for an RFID device. More than one functional block may bedeposited into a strap substrate depending on application.

A strap assembly is formed when one or more functional blocks aredeposited in the strap substrate and other elements (e.g., dielectriclayer and electrical interconnection) formed thereon. The overallmanufacturing process of a strap assembly impacts the cost of the finaldevice that incorporates the strap assembly. For example, when a strapassembly is formed using a web process, efficiencies of the blockdeposition, dielectric film formation, material usage, or electricalinterconnection fabrication play important roles in the final devicecost and performance.

FIG. 1 illustrates exemplary embodiments of an object that is functionalcomponent block 1. The functional block 1 can have various shapes andsizes. Each functional block 1 has a top surface 2 upon which a circuitelement is situated (not shown). The circuit element on the top surface2 may be an ordinary integrated circuit (IC) for any particularfunction. For example, the IC may be designed to drive a pixel of adisplay. The IC may also be designed to receive power from anothercircuit, such as an antenna, and perform a particular function orfunctions for the operation of a passive RFID tag. Alternatively, the ICmay be designed to receive power from an energy source (e.g. battery)for the operation of an active RFID tag. The functional block 1 alsoincludes a contact pad 3 (one or more contact pads 3) to allowelectrical interconnection to the circuit element on the block 1. Thefunctional block 1 can have a trapezoidal, rectangular, square,cylinder, asymmetrical, or asymmetrical shape. The top of the block 1 isoften (but need not be) wider than the bottom of the block 1. Eachfunctional block 1 may be created from a host substrate and separatedfrom the host substrate. Methods of making a functional block 1 areknown in the art and for instance, can be found U.S. Pat. Nos.5,783,856; 5,824,186; 5,904,545; 5,545,291; and 6,291,896, which arehereby incorporated by reference in their entireties.

FIG. 2A illustrates a cross-sectional view of an exemplary embodiment ofan electronic assembly (or a strap assembly) 200. The assembly 200 canbe part of or made to incorporate into a display device, a RFID tag, amerchandise label (a CD label), a pharmaceutical label or bottle, etc.The assembly 200 can be attached to another substrate (e.g., a devicesubstrate) that may have patterned, printed, or formed thereon aconductor or conductors. A functional block 202 is deposited in recessedregion 204 of a substrate 206 to form the assembly 200. The functionalblock 202 can be the functional block 1 previously discussed. Methods ofmaking a functional block are known in the art. In one embodiment, thefunctional block 202 is a NanoBlock™ made by Alien Technology. Oncedeposited, the functional block 202 is recessed below a surface 208 ofthe substrate 206. In one embodiment, the functional block 202 isrecessed sufficiently below the surface 208 to provide sufficient spacefor electrical connection to the functional block 202. In oneembodiment, the functional block 202 is deposited into the recessedregion 204 using a Fluidic Self-Assembly (FSA) process. The surface 208of the substrate 206 is the native surface of the substrate 206 beforeany deposition of any other materials on top of the surface 208. Thesubstrate 206 may be a flexible substrate made out of plastic, fabric,metal, or some other suitable materials. In one embodiment, thesubstrate 206 is flexible. In one embodiment, the assembly 200 isflexible.

Also shown in FIG. 2A, a dielectric layer 210 is formed over the surface208 and over the functional block 202. The dielectric layer 210 in manyinstances, also functions as a planarization layer as well as a layerthat traps or keeps the functional block 202 in the recessed region 204.Vias 212 are also formed into the dielectric layer 210 to exposeportions of the functional block 202. Typically, each of the exposedportions of the functional block 202 comprises a contact pad 216 thatenables electrical interconnection to the functional block 202. In oneembodiment, the functional block 202 includes two contact pads 216placed on opposite sides and/or diagonal to each other. In suchembodiments, the dielectric layer 210 has two vias 212, one for eachcontact pad 216. Each via 212 exposes some or all of the top area 216-Aof the corresponding contact pad 216 (FIGS. 2B-2C). In one embodiment,as shown in FIG. 2B each via 212 has a diameter that is smaller than thetop area 216-A of the corresponding contact pad 216. In some embodiment,the via 212 has a cone-like shape where the via 212 has a top diameterand a bottom diameter. The bottom diameter is smaller than the topdiameter. In one embodiment, the bottom diameter is at least 20% smallerthan the contact pad 216. Optimally, the diameter of the via 212 at thebottom should be no more than 80% of the width of the contact pad 216,which may be defined by the area 216A. Most optimally, it should be nomore than 60% of the width of the contact pad 216, which may be definedby the area 216A. In one embodiment, the via 212 has a non-symmetricalcone-like shape in which one side of the via 212 has a flatter orgentler slope than the other side (FIG. 2C). As shown in FIG. 2C, thevia 212 has two sides, 212-A and 212-B, in which the side 212-B has amore “gentle” or flatter slope than the side 212-A. In one embodiment, asmall protrusion 212-C is formed on the side 212-B of the via 212. Theconfiguration of the via 212 in accordance to the present embodimenthelps the conductive material to more easily fill the via 212.

In one embodiment, the dielectric film 210 is deposited using aroll-to-roll process over the substrate 206 that has the functionalblock 202 deposited therein. The dielectric film 210 may be depositedusing methods such as lamination of a polymer film or coating of aliquid layer over the substrate 206 and subsequent curing to form thedielectric film 210. In one embodiment, the dielectric film 210 isdeposited by a wet coating process, such as comma coating, or by adirect writing process, and subsequently dried or cured. The dielectricfilm 210 may be necessary in embodiments where the assembly 200 is usedfor devices such as RFID tag since the dielectric film 210 provides goodRF performance for the RFID tag. The dielectric film 210 contains atleast one opening formed through the dielectric film for the via 212.Each via 212 enables the conductive interconnect 214 formed on the topof and into the dielectric film 210 to make electrical connection with acontact pad 216 on the functional block 202.

Each conductive interconnect 214 can be one conductor or two conductorsjoined together. The conductive interconnect 214 can be formed in aone-step process or a two-step process. When the conductive interconnect21 is made of two (2) conductors, one conductor is referred to as a “viaconductor” (214-V) since it fills the via 212. The other conductor isreferred to a “pad conductor” (214-P) which sits on a portion of thedielectric layer 210 and connects or joins the via conductor 214-V.

Each via 212 in the dielectric film 210 is positioned over a contact pad216, such that the via 212 enables interconnection from the contact pad216 on the functional block 202 to the interconnect 214. In oneembodiment, each via 212 is formed such that no dielectric material ispresent in the via 212.

In many embodiments, there are two (2) (or more) vias 212 created overeach functional block 202. The number of vias 212 can be increased ordecreased depending on the product. The number of vias 212 also dependson how many contact pads 216 are present in the functional block 202 ordepending on how many electrical connections are needed. For example,many more dielectric vias may be needed for embodiments where theassembly 200 is incorporated into display driver or sensor applications.In one embodiment, there are two contact pads 216 on the functionalblock 202 and the contact pads are situated diagonally to each other. Insuch embodiment, the dielectric film 210 has two vias 212 which are alsosituated diagonally to each other over the corresponding contact pads216.

In one embodiment, the dielectric film 210 has a thickness ranging fromabout 5 μm to about 60 μm. In another embodiment, the thickness of thedielectric film 210 is approximately 38 μm. The dielectric can be formedeither as a wet film that is dried or cured, or as a dry film that islaminated onto the substrate 206.

In one embodiment, the dielectric film 210 has an adhesive functionalityto the side that is applied to the substrate 206. The adhesivefunctionality could be an inherent property of the dielectric materialor its application process, or it could be due to an adhesive film thatis applied to the side of the dielectric film 210 that comes in contactwith the substrate 206. In embodiments where an adhesive film is used toprovide the adhesive to the dielectric film 210, the adhesive film isnon-conductive and can be processed to achieve the desired structure forthe via 212. For example, the adhesive film may be photo imageable orlaser drillable to allow the via 212 to be formed. A laser drillableadhesive film could be fabricated by using an adhesive that inherentlyabsorbs UV light, or else by using an adhesive formulation that consistsof a UV-absorbing species. A photo-imageable or laser-drillable adhesivemight also enable direct electrical contact to the contact pad withoutan intermediate cleaning or de-scum process. If an adhesive film is usedon the dielectric film 210, all of the dimensions listed for thedielectric film 210, including film thickness and via diameter, appliesto the dielectric and adhesive film combined together.

In one embodiment, the dielectric film 210 has a coefficient of thermalexpansion (CTE) that is closely matched to that of the substrate 206.Preferably, the CTE is within ±20 ppm/° C. of the CTE of the basematerial of the substrate 206, which is typically 50-70 ppm/C, but canvary depending on the substrate. The proximity of the dielectric filmCTE to the substrate film CTE is more important than the absolute valueof the substrate film CTE. Suitable dielectric materials include, butare not limited to, polyimide, polyetherimide, liquid crystal polymer,and polyethylenenaphthalate.

In one embodiment, the vias 212 in the dielectric film 210 are formedover corner areas of the functional block 202. In one embodiment, thevias 212 are only formed over the corners of the functional blocks withthe contact pads 216. Additionally, the dielectric film 210 may also beformed only in discrete or selected positions on or around thefunctional block 202 and around the area of the substrate 206 that hasthe functional block 202 deposited therein. When the dielectric film 210is discretely or selectively formed, the vias 212 may not be necessarysince the dielectric material may be selected to not form over thecontact pads 216 to leave the contact pads 216 exposed. A method thatcan be used for selectively or discretely forming the dielectric film210 includes direct write, such as inkjet, and laser assisteddeposition, etc. Such method enables the deposition of the dielectricfilm 210 anywhere the material is needed. Additionally, such selectivedeposition of the dielectric film 210 enables customizing deposition ofthe dielectric film for uses such as bridging or covering the gap fromthe functional block 202 to the substrate surface 208, and/or to protectsensitive areas on the functional block 202. Such selective depositionof the dielectric film 210 minimizes the use of the dielectric materialwhere it is not needed. Other methods that can be used for selectivelyor discretely form the dielectric film 210 include patterning, etching,and photolithography.

One advantage of a structure that incorporates a via or vias and adielectric layer is that the dielectric layer is necessarily disposedbetween the functional block, which can be an integrated circuit (IC)for a device, and the conductive interconnect or conductive traces,which could be used to connect the functional block to an externalelectronic element such as an antenna. The via through the dielectricmaterial provides a direct electrical connection to the IC, but there isstill a capacitive coupling between other parts of the functional blocksand the external electronic element. It is disadvantageous to have suchcapacitive coupling between the IC and the conductive traces, and thiscapacitive coupling is increased due to proximity of the conductivetraces to the IC. Placing the dielectric layer between the functionalblock and the external electronic element provides some verticaldistance between them. Minimizing the size of the interconnection pad,and increasing the vertical distance between the traces and IC,minimizes this capacitive coupling. Additionally, the use of lowdielectric constant materials as the dielectric layer will also minimizethis capacitive coupling. Examples of low-dielectric constant materialsinclude porous materials, fluorinated materials, and silicon-richmaterials.

In one embodiment, each conductive interconnect 214 formed on top of andinto (in a via created in the dielectric layer 208) the dielectric layer208 fills a particular vias 212 so as to establish electricalinterconnection to the functional block 202. In the present embodiment,each conductive interconnect 214 constitutes both a via conductor 214-Vas well as a pad conductor 214-P. When each of the conductiveinterconnects 214 fills via 212, the conductive material covers all ofthe exposed area of the contact pad 216 that is exposed by the via 212.In one embodiment, the conductive interconnect 214 constitutes aconductive trace of an antenna element or acts as an interconnect for anantenna element. The conductive interconnect 214 can also interconnectthe functional block 202 to an external electrical element or elements(e.g., antennas or electrodes). The conductive interconnect 214 can alsobe an electrical or conductive lead from the external electricalelement.

In one embodiment, the conductive interconnect 214 is formed using aroll-to-roll process. For example, materials used to form theinterconnect 214 is deposited onto and into the dielectric layer 208 asthe substrate 208 is processed on a web line. Material used to make theconductive interconnect 214 may be selected such that it can be cured,for example, by heat or by electromagnetic or ultraviolet radiation, andcan be used in the roll-to-roll process. For example, the interconnect214 material is cured as the substrate 206 is processed on a web line.In one embodiment the conductive interconnect 214 is made of aconductive composite of conductive particles in a non-conductive matrix,such as silver ink. In another embodiment, the conductive interconnect214 is made of metal or metals that are evaporated onto the substrate206 or onto the dielectric layer 210, over the corresponding via 212,and subsequently patterned. The conductive interconnect 214 can also becomprised of an organic conductor, or composites of carbon nanotubes orinorganic nanowires dispersed in a binder. In one embodiment theconductive interconnect 214 is made of a conductive composite, such assilver ink or silver-filled epoxy that completely filled by thecorresponding vias 212. In one embodiment, the conductive interconnect214 is made of one or more of the following: conductive particlesdispersed in a nonconductive or an organometallic matrix (e.g., silverink), sputtered or evaporated metal, conductive carbon composite, carbonnanotubes, inorganic nanowires dispersed in a nonconductive matrix, andany of these materials combined with metallic nanoparticles. In oneembodiment, the conductive interconnect 214 comprises a nonconductivematrix that consists of a thermoplastic polymer, a thermoset polymer, ora B-staged thermoset polymer. In one embodiment, the elastic modulus ofa conductive composite that is used to form the conductive interconnect214 is between 120,000 psi and 60,000 psi. The resistivity of theconductive interconnect 214 is less than 76 mΩ/square/mil, moreoptimally, less than 60 mΩ/square/mil, even more optimally less than 42mΩ/square/mil, and most optimally less than 25 mΩ/square/mil.Additionally, the conductive interconnect 214 is made of a material thatis able to maintain good electrical contact to the top-most conductivefeature or features (e.g., the contact pad 216) on the functional block202, such that the combination of the substrate 206, the functionalblock 202, the dielectric layer 210, the contact pad 216, and theconductive interconnect 214 is able to maintain sufficient electricalcontact throughout, with less than a 10% variation in total resistance.In one embodiment, the combination of the substrate 206, the functionalblock 202, the dielectric layer 210, the contact pad 216, and theconductive interconnect 214 is able to maintain sufficient electricalcontact throughout, with less than a 10% variation in total resistance,when the assembly 200 is subjected to thermal cycles for 100 times from−40° C. to 85° C., and bent over a 1-inch-diameter mandrel for 80-100times. Each conductive interconnect 214 can partially or completelycover the corresponding via 212 for the conductive material in the via212 to make electrical contact to the functional block 202 or thecorresponding contact pad 216 on the functional block 202. Additionally,the conductive interconnects 214 also have a good adhesion to thedielectric film 210, such that the interconnects can survive flexingover a 1-inch mandrel as previously mentioned.

In one embodiment, the conductive interconnect 214 is coupled to anotherconductive trace (not shown) that may be formed on the substrate 206.Such conductive trace can be an antenna trace, for example, when theassembly 200 is to be incorporated into an RFID tag. Alternatively, theconductive interconnect 214 also forms the conductive trace for thefinal device itself. For example, the conductive interconnect 214 canalso be part of an antenna element for an RFID tag. The conductiveinterconnect 214 and the conductive trace could be combined as onematerial applied in one process, or as two materials applied in twosequential steps.

In one embodiment, the interconnect 214 constitutes a via conductor214-V and a pad conductor 214-P connecting to a particular contact pad216. The via conductor 214-V contacts the conductive pad 216 on thefunctional block 202 at the bottom of the via 212. It is preferable thatthe via conductor 214-V covers all of the contact pad 216 that isexposed by the via 212.

In one embodiment, the top diameter or the top area of the via conductor214-V is larger than the top diameter of the corresponding via 212. Inone embodiment, the top diameter or the top area of the via conductor214-V is about 1-3 times larger than the top diameter of the via 212. Inanother embodiment, top diameter or the top area of the via conductor214-V is 1-2 times larger than the top diameter of the via 212.

The pad conductor 214-P, in one embodiment, provides a large or largerconductive area for fast electrical attachment of the assembly 200 to aconductor on another electrical functional element, such as a RFIDantenna, a display driver strip, or a sensor assembly. In oneembodiment, the pad conductor 214-P is at least (1 mm)×(1 mm) large.Since this interconnection area is larger than the connection or contactpad 216 on the functional block 202, lower-cost, lower-precisionequipment can be used to produce electrical contact between the assembly200 and other functional elements such as antennas. The pad conductor214-P may be made of the same material or different material as the viaconductor 214-V.

The pad conductor 214-P must make electrical contact with any necessaryconductive material in the via 212 (e.g., the via conductor 214-V) aswell as the corresponding contact pad 216 that may be provided on thefunctional block 202. The conductive interconnect 214 may have severallayouts. Exemplary layouts are shown in FIGS. 2D-2F, below. The layoutsin FIGS. 2D-2F illustrate exemplary configurations for the pad conductor214-P of the conductive interconnects 214. It is to be noted that otherconfigurations are also feasible.

Typically, the assembly 200 includes more than one interconnections 214and more than one pad conductor 214-P. For instance, the functionalblock 202 has two contact pads 216 so that multiple connections areneeded. In FIG. 2D, a “bow-tie” configuration 214-A is provided. In thisconfiguration, two pad conductors 214-P form a bow tie-likeconfiguration. The configuration 214-A includes two pad conductors214-P, each of which having two fingers 244 coming out of each padconductor. The fingers 244 are able to make contact with each of thecontact pad 216 at any of the 4 corners of the functional block 202.Each finger 244 would make contact to a contact pad 216 that is closestto the corresponding finger 244. It is preferred to have a limitedamount of conductive interconnect 214 over the functional block 202 suchthat the amount of stray capacitance is limited. Thus, only a smallsection of each finger 244 overlaps the functional block 202 or acontact pad 216 provided on the block 202. In one embodiment, the finger244 is less than or equal to the top diameter of the correspondingcontact pad 216 that the finger 244 connects to. In one embodiment, thefinger 244 covers a portion of the via conductor that connects to thecontact pad 216. In one embodiment, the finger 244 covers all of the viaconductor that connects to the contact pad 216. The bow-tieconfiguration 214-A enables the conductive interconnect 214 to makecontact to the functional block 202 where the contact pads 216 is placedon any of the four corners of the functional block 202. It may be thatthe functional block 202 has one contact pad 216. Thus, not all of thefingers 244 would contact a contact pad 216. The functional block 202thus can also be deposited into a receptor 204 in a manner where thecontact pads 216 can be oriented at any corner and still able to allowcontact from the fingers 244 to the contacts pads 216.

In FIG. 2E (a)-FIG. 2E (b), another “bow-tie” configuration 214-B, whichdoes not have the fingers 244 shown in the bow-tie configuration 214-Ais provided. Instead, in the bow-tie configuration 214-B, sides 246 areprovided on the pad conductors 214-P where each of the sides 246 runsacross almost the length of each side of the functional block 202. Inthis configuration, two pad conductors 214-P also form a bow tie-likeconfiguration over parts of the functional block 202. In the presentembodiment, each of the sides 246 is placed in contact with a contactpad 216 on the functional block 202. The contact pad 216 can be a cornerlocation as shown in FIG. 2E(a) or at a center location as shown in FIG.2E(b).

FIG. 2F illustrates an exemplary embodiment of a configuration of theconductive interconnect 214 or the pad conductor 214-P with anon-bow-tie configuration 21C. In the present embodiment, the functionalblock 202 may have contact pads 216 placed diagonally to each other. Theconfiguration 214-C is similar to the configurations 214-A and 214-Babove except that only one arm is necessary on each pad. Theconfiguration 214-C is configured with two pad conductors 214-P eachhaving an arm or extension 248 to make connection to one of the contactpads 216. The arm 238 allows the conductive interconnect 214 to contactthe functional block 202 with minimal conductive material over thefunctional block 202. Other configurations or shape for the extension248 are possible. The configuration 214-C is especially useful when thefunctional block does not have rotational symmetry that is greater than2-fold.

In FIGS. 2D-2F, the contact pads 216 are shown to contact the fingers244 or the sides 246 of the pad conductor. As previously mentioned, thedielectric layer 210 may be formed over the block 202 and the vias 212are created in the dielectric layer 210 so that the contact pads 216 areexposed. The vias are filled with conductive interconnects 214 or viaconductors 214-V as previously mentioned. As previously mentioned, thevias could also be filled by the same material and at the same time asthe sides 246 are form. The fingers or sides from the pad conductors214-P cover at least a portion of the corresponding via conductors 214-Vto establish interconnection to the contact pads 216. For the sake ofillustrating the pad conductor layouts, the vias 212 and the viaconductors 214-V are not shown in FIGS. 2D-2F.

In one embodiment, each pad conductor 214-P has a resistivity that isless than 25 mΩ/square/mil, optimally less than 18 mΩ/square/mil, andmost optimally less than 12 mΩ/square/mil.

In one embodiment, each part of the pad conductor part 214-P that isover the via conductor should be no wider than 2 times the smallestdiameter of the corresponding via conductor 214-V, optimally no widerthan 1.5 times the diameter of the via conductor 214-V, and moreoptimally, the same width as the widest diameter of the via conductor214-V. The assembly 200 shown in FIG. 2A can be referred to as a strapassembly.

In one embodiment, the strap assembly 200 is further coupled or attachedto another device for form a final device (for example, to form an RFIDtag). FIG. 2G illustrates a cross-sectional view of the strap assembly200 being attached to a second substrate or a device substrate 201. Thesubstrate 201 may include other active elements and/or electricalcomponents and in one embodiment, includes a conductor pattern 203formed thereon. In one embodiment, the conductor pattern 203 is part ofan antenna element that can be used for an RFID device. In oneembodiment, the substrate 206 is “flipped” over such that the surface208 is facing the second substrate 201 and the conductor pattern 203.The substrate 206 is attached to the second substrate 201 in a way thatthe conductor pattern 203 is coupled to the interconnects 214.Conductive adhesives may be used to facilitate the attachment of thestrap assembly 200 to the substrate 206. Other sealing materials canalso be added.

In one embodiment, the substrate 206 is a monolayer plastic film such asthe substrate 206 shown in FIG. 2A. A plastic monolayer base film can bea thermoset or an amorphous or semicrystalline thermoplastic plasticfilm. In one embodiment, the substrate 206 is a thermoplastic base filmand has a glass transition temperature (Tg) of at least about 100° C.,more optimally at least about 125° C., and even more optimally at leastabout 145° C.-150° C. The thermoset plastic film can be selected fromUV-curable, moisture-curable, and heat-curable thermoset plastic films.Example of suitable materials that can be used for the substrate 206include, but are not limited to, polyethylene, polystyrene,polypropylene, polynorbornene, polycarbonate, liquid crystal polymer,polysulfone, polyetherimide, polyamide, polyethylene terephthalate, andpolyethylene naphthalate, and derivatives thereof.

In alternative embodiments, the substrate 206 comprises multiple layersfor example, layers 206A-206D, with the recessed regions 204 formed inone of the layers, e.g., the top layer 206A and with the additionallayers used to provide one or more of dimensional stability, mechanicalstrength, dielectric properties, desired thickness, functionalities, etc(FIG. 3).

The substrate 206 is made of a material that minimizes positionaldistortion of the recessed region 204 after the substrate 206 issubjected to a first thermal excursion for about 30 minutes at about125° C. Prior to assembling the functional block 202 into the recessedregion 204, the substrate 206 is subjected to at least one thermalexcursion cycle for about 30 minutes at about 125° C. During thisthermal excursion cycle, the recessed region 204 that is formed into thesubstrate 206 may be distorted positionally. The position of therecessed region 204 on the substrate 206 may move or be distortedslightly due to the heat or change of material characterization due toheat. In one embodiment, the substrate 206 must be made of a materialthat will cause only about 30-500 μm, more optimally, 30-300 μm,positional distortion to the location of the recessed region 204 that isformed on the substrate 206. Positional distortion refers to thelocation of the recessed region 204 being moved positionally from theoriginally created position on the substrate 206. In one embodiment, thesubstrate has a length of about 200 mm, along which the distortion ismeasured. Thus, the substrate 206 is made of a material that whensubjected to a first thermal excursion causes the recessed region to bemove by only about 30-500 μm, or 30-300 μm. In another embodiment, thesubstrate could have a length that is 300 mm or 500 mm long, and theallowable distortion along such a length would scale linearly with thedistortion allowed along a shorter length.

In one embodiment, when the substrate 206 is subjected to a process thatforms the recessed region 204, areas around the area where the recessedregion 204 is to be formed is maintained at a temperature between about50° C. and the glass transition temperature of the substrate material.Such temperature control minimizes distortion to the substrate 206 asthe recessed region 204 is being formed.

The recessed region 204 is at least as large as the functional block 202that fills the recessed region 204. More optimally, the recessed region204 is slightly larger (e.g., 0-10 μm or 1-10 μm) than the functionalblock 202 in width, depth, and length, and has a sloping sidewallsimilar to that of the shaped functional block 202. In general, therecessed region matches the shape of the functional block; if thefunctional block 202 is square, the recessed region 204 is also square,and if the functional block 202 is rectangular, the recessed region 204is also rectangular.

In one embodiment, the substrate 206 is substantially flat, especiallyin or near the recessed region 204. Substantially flat is characterizedby surfaces of the substrate having no protrusion or no protrusiongreater than 5 μm. In other words, if there are any protrusions at all,the protrusion is not greater than 5 μm, thus giving the substrate 206 asubstantially flat characteristic. FIG. 4 illustrates an exemplaryembodiment of the substrate 206 with a top surface 208 that issubstantially flat. The substrate 206 only needs to have its top surface208 (or alternatively, the top surface of the top layer of the substrate206 when the substrate includes multiple layers) being substantiallyflat. As shown in FIG. 4, the sides of the recessed region 204 aresubstantially flat, as well. Thus, top sides 204-T, bottom side 204-B,and sidewalls 204-W of the recessed region 204 are substantially flatwith no protrusion. FIG. 5 illustrates an exemplary embodiment of thesubstrate 206 with some minor protrusions 220 along a surface of thesubstrate 206. Nevertheless, the protrusions 220 are so minor that thesubstrate 206 still has the substantially flat characteristic and thatthe recessed region 204 has sides that are substantially flat.

The recessed region 204 has a width-depth aspect ratio that isconfigured to substantially match a width-depth aspect ratio of thefunctional block 202. In one embodiment, the recessed region 204 has awidth-depth aspect ratio that is less than 14:1, optimally, less than10.5:1, and even more optimally, less than 7.5:1. The functional block202 thus has a similar width-depth aspect ratio.

The substrate 206 is also selected so that the substrate has a goodthermal stability to withstand standard processing. The material of thesubstrate 206 is such that the substrate 206 allows the recessed region204 to maintain the same positional accuracy requirements previouslymentioned. The substrate 206 is made of a material that is able to allowthe recessed region 204 to maintain its positional accuracy after goingthrough a 125° C.-150° C. thermal excursion.

In many embodiments, the assembly 200 is cut, sliced, separated, orsingulated from a plurality of web-assembled assemblies as will bedescribed below. Thus, a plurality of assemblies 200 can be formed inone short time frame. A roll-to-roll process can be used. A websubstrate is provided. The web substrate may be a continuous sheet ofweb material which when coiled, is a roll form. A plurality of recessedregions 204 is formed into the web material to form the web substrate. Aplurality of functional blocks 202 are deposited into the recessedregions 204 on the web substrate (e.g., using an FSA process) to form aplurality of the assemblies 200 shown in FIG. 2A. Areas or strips of theweb substrate can later be sliced, singulated, cut, or otherwiseseparated to produce individual assemblies 200. In one embodiment, a websheet having a plurality of assemblies 200 is attached to another websubstrate similarly to previously described in FIG. 2G. Individualdevices can then be formed by slicing or singulating after thesubstrates are adhered to one another as illustrated in FIG. 2G.

FIGS. 6A-6B illustrate an assembly 400 that includes several assembliesformed similarly to the assembly 200. The assembly 400 is similar to theassembly 200 above except when multiple assemblies are formed on onepiece of substrate material. In FIGS. 6A-6B, a substrate 406 includes aplurality or a population of recessed regions 404 formed therein. Eachrecessed region 404 includes a functional block 402 deposited therein.The assembly 400 is also similar to the assembly 200 shown above exceptthat there are more of the functional blocks deposited in the substrate.Singulating areas of the substrate 406 after the functional blocks 402have been deposited and other elements formed thereon can produce aplurality of assemblies 200 shown above. The substrate 406 can be a websubstrate, a frame of a web substrate, a section of a web substrate, ora sheet substrate. In some embodiments, all of the available recessedregions 404 in the substrate 406 are filled with functional blocks 402.In some embodiments, 90-100% of the available recessed regions 404 inthe substrate 406 are filled with functional blocks 402. In yet otherembodiments, 50-100% of the available recessed regions 404 are filled.

The recessed region 404 has a width-depth aspect ratio that isconfigured to substantially match a width-depth aspect ratio of thefunctional block 402. In one embodiment, the population of the recessedregions 404 has an average width-depth aspect ratio that substantiallymatches the average width-depth aspect ratio of the functional blocks402 or in some case, the width-depth aspect ratio of each of thefunctional blocks 402. The average width-depth aspect ratio of thepopulation of the recessed region is less than 14:1, optimally, lessthan 10.5:1, and even more optimally, less than 7.5:1. The functionalblocks 402 thus have a similar width-depth aspect ratio to the recessedregions' width-depth aspect ratio.

In terms of recessed regions' depth, it is important to take intoaccount the entire population of the depths 404-R of the recessedregions 404 and the thicknesses 402-D of the functional blocks 402. Thethickness 402-D of each of the functional blocks 402 should account forany contact pads on top of the functional block 402. In one embodiment,after all the functional blocks 402 are deposited into theircorresponding recessed regions 402, a substantial amount of theplurality of functional blocks 402 are recessed below a top surface406-T of the substrate 406. In one embodiment, there is a gap 408between the top surface 402-T of the functional block 402 and the topsurface 406-T of the substrate 406. In one embodiment, the gap 408 isbetween about 0-10 μm. In one embodiment, the substantial amount of thefunctional blocks 402 being recessed below the surface of the substrate406 is defined by (1) less than 10% of the population of the functionalblocks protrude above the top surface 406-T of the substrate 406; (2)less than 1% of the population of the functional blocks 402 protrudeabove the top surface 406-T of the substrate 406; (3) more than 90% ofthe functional blocks 402 are recessed below the top surface 406-T ofthe substrate 406; or (4) more than 99% of the population of thefunctional blocks 402 are recessed below the top surface 406-T of thesubstrate 406.

The populations of the depths 404-R of the recessed regions 404 and thethicknesses 402-D of the functional block thickness can be representedby distribution with an average depth or thickness (μ_(r) or μ_(N),respectively) and a standard deviation (σ_(r) or σ_(N), respectively).The probability that a functional block 402 protrudes up from a recessedregion 404 can be determined by comparing the difference (A) in averagesto the combined standard deviation, σ_(c), where

Δ=μ_(r)−μ_(N)

and

σ_(c)=√{square root over (σ_(r) ²+σ_(N) ²)}.

It is desirable to have σ_(c)<Δ. More preferably, using the equationsabove and applying Normal statistics, it is preferable to have σ_(c) andΔ such that less than 10%, or more preferably less than 1%, of thepopulation of the functional blocks 402 protrude above the top surface406-T of the recessed regions 404.

In one embodiment, the assembly 400 is characterized in that thelocations of the recessed regions 405 on the substrate 406 have a goodpositional accuracy. In one embodiment, across a 158 mm-wide area of thesubstrate 406, the positional accuracy of each recessed region 404 iswithin 100 μm at 3σ, in another embodiment, within 50 μm at 3σ, and inanother embodiment, within 30 μm at 3σ. These positional accuracynumbers also scale linearly with the width of the substrate 406. Forexample, when the substrate 406 has a width of about 316 mm thepositional accuracy of the recessed regions 404 is within 200 μm at 3σ.Similar to the assembly 200, the assembly 400 includes a dielectric filmformed over the functional blocks 402, vias formed in the dielectricfilm to expose contact pads on the functional blocks 402, and conductiveinterconnections to establish electrical connections to the functionalblocks 402.

The substrate 206 or 406 with recessed regions previously described canbe processed using various exemplary methods and apparatuses of thepresent invention to form the recessed regions.

One embodiment in accordance with the invention includes a substrate inwhich a roller having protruding features is moved across the substrateand/or pressed down on the substrate. The roller creates holes orrecessed regions in the substrate. Another embodiment includes or asubstrate that passes under a roller having protruding features and thesubstrate contacts the protruding structures from the roller. In oneembodiment, a template in which structures protrude from the template isused to create recessed regions in a substrate. The template is pressedagainst the substrate to create recessed regions or holes in thesubstrate. Another embodiment of the invention relates to creatingrecessed regions or holes in a web material using either a roller or atemplate. Another embodiment of the invention relates to creatingrecessed regions or holes in a web material using either a roller or atemplate in which heat is also applied to the polymer film to enable therecessed region formation process. In one embodiment, a device withfeatures such as embossing features configured to create recessedregions is used. FIG. 7A shows a template 51 with protruding structures52. The protruding structures 52 may vary in shapes and sizes dependingupon the object that is to be placed into a substrate or web materialthat is used to create the substrate 406 or 206 previously described.The length of the protruding structure 52 may range from 500 angstromsto 85 microns or larger in some cases. Similarly, the diameter or otherdimension (e.g., width) of a protruding structures 52 may range from 100angstroms to 70 microns to 900 microns or larger in some cases.

In the embodiment where the template 51 is an embossing mold, theprotruding structures 52 have feature dimensions and/or pitch that are0.5-1% larger than the desired dimensions of the corresponding recessedregions to be formed on the substrate. In the present embodiment, thesubstrate will have the recessed regions formed with a pitch that hassubstantially similar pitch to the pitch of the recessed regions. Theprecise dimensions of the final product can thus be controlled. This isnecessary so that sufficient alignment occurs through the assembling orfabrication process of the particular apparatus.

In one embodiment, the protruding structure 52 has a width-depth aspectratio that is less than 10.5:1 or more optimally, less than 7.5:1.Additionally, the protruding structures 52 also have the shape that isthe shape of the corresponding functional blocks to be deposited in therecessed regions.

The template 51 is comprised of sturdy materials (e.g., steel, polymers,etc.). In one embodiment, the template is an electroform stamper copymade from an electroform mother copy, which is made from a master moldthat is made by either etching a silicon wafer or diamond turningmachining a metal plate or roller. In another embodiment, the templateis an electroform stamper copy made from a master mold negative that ismade by etching a silicon wafer. In another embodiment, the template isan electroform stamper copy made by coupling (e.g., welding orattaching) together smaller electroform stamper copies to make a lineararray (for example, x by 1) of stampers, where x>1. In anotherembodiment, the template is an electroform stamper copy made by weldingtogether smaller electroform stamper copies to make an array (forexample, x by y) of stampers, where both x and y are greater than 1.

FIG. 7B shows the template 51 with the protruding structures 52 facingone side of a substrate 50. The substrate 50 can be the substrate 406 or206 previously mentioned. FIG. 7C shows the template 51 contacting thesubstrate 50 and the protruding structures 52 from the template 51pierce or press into the substrate 50. These protruding structures 52may be a variety of shapes depending on the shapes of objects to bedeposited onto the substrate 50. Heat, electromagnetic radiation, or UVlight may be applied at any point in this process to assist in thepattern transfer. FIG. 7D shows that when the template 51 is separatedfrom the substrate 50, recessed regions or holes 53 are created in thesubstrate 50. The recessed regions 53 can be the recessed regions 404 or204 previously mentioned.

The template 51 can be coupled to a vertical hot press and used tocreate the recessed regions on the substrate 50. The vertical hot presscan be configured to move up or down to cause the template 51 to contactthe substrate 50 in the manner described above so that the protrudingstructures 52 can create the recessed regions 53 into the substrate 50.The template 51 can also be configured to be used in a step-and-repeatprocess to make the substrate 50.

In one embodiment, the substrate 50 is a web substrate that once coiled,has a roll form. When formed from a step-and repeat process, one area ofthe substrate 50 is formed at a time by the template 51. Each individualarea of the substrate is referred to as a frame. For optimal processconditions, it is important that the web substrate not haveunpredictable or uncontrolled ridges, channels, indentations, orstep-changes between individual frames of the web substrate. The ridges,channels, indentations, or step-changes between individual frames of theweb substrate may cause interruption, disruption, or unpredictablechanges in the movement in the flow of the slurry that carries thefunctional blocks to be deposited into the recessed regions 53 as isused in an FSA process. In one embodiment, a “frame” is approximately6-inches-long in the material direction of the web substrate, and inother embodiments, a frame can be of any length, ranging from as smallas one inch to arbitrarily long, such as 4-feet-long or 8-feet-long orlonger.

Various embossing techniques use a repeating process in which anembossing tool provided with a template such as the template 51 ispressed against the web substrate at elevated temperature to emboss therecessed regions into the web substrate. Next, the embossing tool isseparated from the web substrate and the web substrate is indexedforward one frame-length for the next frame/area. This entire process isrepeated for as many frames as necessary to complete the web substrateof a particular length. Such process, and other embossing processes, canleave an uncontrolled step-change between the frames of the websubstrate. This step-change can typically be about 10-50 μm tall ortaller, 0.5-2 mm wide, and may not be continuous in the cross-directionof the web. FIG. 7E illustrates a cross-sectional view of an example ofstep-changes created between frames of a web substrate 70. In thisfigure, the web substrate 70 is processed using a step-and-repeatprocess in which step-changes 72 are formed between each two frames 74.In many instances, the step-changes 72 are not uniform or continuous inthe same direction from frame to frame as shown in FIG. 7E. Similarly,as shown in FIG. 7F, step-changes can include channels or indentations76 that are formed between frames 74. These types of step-changes shouldbe avoided in the web substrate. These step-changes 72 or 76unpredictably or uncontrollably interrupt the flow of the functionalblocks during the FSA process, and therefore are detrimental to theprocess.

Many techniques used to form the recessed region in the web substratecan cause similar step-changes. Thus, the types of step-changesmentioned above can be formed in substrates that are processed otherwiseand not necessarily results of step-and-repeat processes. For instance,the step-changes may be caused by a continuous belt that may be presentin some processing. A roller used to form the recessed regions in theweb substrate could have features that may cause similar step-changes inthe web substrate. Uncontrolled step-changes are thus not desired for aweb substrate whether the substrate is processed by a step-and-repeatprocess or by a continuous process.

A step-change between frames, however, may be acceptable in the websubstrate if the step change is always in the same direction or in acontrolled direction. That way, the FSA process can be controlled ormonitored accordingly to a predictable presence of a step-change that isalways in the same direction. In one embodiment, a step-change iscreated into the web substrate such that when examining the spacebetween two frames on the web substrate, there is a step going from oneframe to the next, and that the step is always higher on the left side,or is always higher on the right side, or always in the same direction.For instance, as illustrated in FIG. 7G, a web substrate 76 is formedsuch that there are a plurality of frames 74. Each frame 74 is separatedfrom another frame by a step-change 78. The step-change 78 isconsistently in the same direction from one frame 74 to the next frame74. As can be seen, the step-change 78 is always higher on the left sidethan the right side of the step-change 78. FIG. 7H illustrates anotherexample of a consistent or uniform step-change between two frames of theweb substrate 76. One advantage of the consistent step-change is thatthe flow of FSA slurry is not disrupted by the step-changes 78unexpectedly and thus, the FSA process can be more controlled. Atemplate used to create the recessed regions may incorporate a featurethat can create such a step-change in the substrate.

In some embodiments, instead of using a template and a step-and-repeatprocess to create recessed regions or holes, a roller or a drum 54 withprotruding structures 55 is used on a substrate 50 (FIGS. 7I-7M). Thesubstrate 50 can be processed to form recessed regions thereon in acontinuous process in which a roller passes across the substrate to formthe recessed regions. A similar template to the template 51 can becreated and coupled to a roller that can be used to form the recessedregions. A roller 54 may be comprised of sturdy materials (e.g., steel,polymers, aluminum, electroformed nickel, machined copper, rubber,etc.). FIG. 7I shows a roller 54 with the protruding structures 55. FIG.7J shows a substrate 50 without recessed regions or holes. FIG. 7K showsthe roller 54 contacting the substrate 50 in a manner that theprotruding structures 55 pressing into the substrate 50. FIGS. 7L-7Mshow the roller 54 moving across the substrate 50. Recessed regions orholes 53 are created in the substrate 50 after the protruding structures55 on the roller 54 pierce the substrate 50 and then are removed fromthe substrate 50 as the roller 54 moves across the substrate 50. Itshould be noted that a roller includes a web wheel, a drum, or asupported belt.

The substrate 50 can be a sheet substrate or a web substrate aspreviously mentioned. The roller 54 may be placed so that the roller 54rolls or moves across and on top of the substrate 50. Alternatively, theroller 54 may be placed so that the roller 54 rolls or moves across andon the bottom of the substrate 50. The substrate 50 may be comprised ofpolyether sulfone (PES), polysulfone, polyether imide, polyethyleneterephthalate, polycarbonate, polybutylene terephthalate, polyphenylenesulfide (PPS), polypropylene, polyester, aramid, polyamide-imide (PAI),polyimide, nylon material (e.g. polyiamide), aromatic polyimides,polyetherimide, polyvinyl chloride, acrylonitrile butadiene styrene(ABS), or metallic materials. Additionally, the substrate 50 when in aweb process can be a flexible sheet with very high aspect ratios such as25:1 or more (length:width). As is known, a web material involves a rollprocess. For example, a roll of paper towels when unrolled is said to bein web form and it is fabricated in a process referred to as a webprocess. When a web is coiled, it is in roll form.

FIG. 8 shows an overall process of fabricating an electronic assembly inaccording to embodiments of the present invention. Although thediscussion below illustrates processes that may be continuous, otherseparate or sub-processes can also be used. For instance, a process thatis continuous as shown in FIG. 8 can be separated into separate orsub-processes. The process in FIG. 8 can take place on one machine or onseveral machines.

FIG. 8 illustrates a web process where a web substrate is used forforming a plurality of electronic assemblies such as the assembly 200 or400 previously described. A roll of substrate 120 is provided. Thesubstrate 120 is flexible. The substrate 120 may besprocket-hole-punched to assist in web handling. The substrate 120 isadvanced from a station 117 or a roller 117 to a station 119 that formsa plurality of recessed regions as previously described. The recessedregions can be formed by machining, etching, casting, embossing,extruding, stamping, or molding. In one embodiment, a roller such as theroller 54 as previously described with protruding structures is providedfor the formation of the recessed regions. The substrate 120 is advancedthrough a set of support members 122 as the recessed regions are createdinto the substrate 120. An fluid self-assembly process can be used todeposit a plurality of functional blocks into the recessed regionsformed in the substrate. In one embodiment, a first slurry 124containing a plurality of functional blocks is dispensed onto thesubstrate 120. A second slurry 126 containing a plurality of functionalblocks may also be used to dispense onto the substrate 120. Excessslurry is collected in container 128 and is recycled. The functionalblocks fall into the recessed regions in the substrate. The substrate120 is then advanced to another set of support members 130. Aninspection station (not shown) may be provided to check for emptyrecessed regions or for improperly filled recessed regions. There mayalso be a clearing device (not shown) to remove excess functional blocksor blocks not completely seated or deposited into the recessed regionsof the substrate 120. A vibration device (not shown) may be coupled tothe substrate 120 and/or to the slurry dispensing device to facilitatethe distribution and/or of the functional blocks. An example of adispensing device that can work with vibrational assistance to dispensethe functional blocks is described in U.S. patent application Ser. No.10/086,491, entitled “Method and Apparatus For Moving Blocks” filed onFeb. 28, 2002, which is hereby incorporated by reference in itsentirety. In one embodiment, the functional blocks are deposited ontothe substrate material using methods described in U.S. patentapplication Ser. No. 10/086,491. In one embodiment, the functionalblocks are deposited onto the substrate using fluidic self-assemblyprocess on a continuously moving web (the substrate 120).

The functional blocks can have shapes such as square, rectangular,trapezoid, cylinder, asymmetric block, asymmetric rectangular, andasymmetric trapezoid. The recessed regions have similar shapes as thefunctional blocks.

Continuing with FIG. 8, and generally shown at 132, a planarization (ordielectric) layer is then deposited or laminated or otherwise formedonto the substrate material. Vias are formed in the dielectric film. Thedielectric layer can be applied using a variety of methods. Mostcommonly, a solid dielectric film is used, which can be applied with ahot roll laminator. Alternatively, a liquid dielectric could be appliedby spin coating in sheet form using any variety of a printing methods,such as direct writing, laser-assisted deposition, screen printing, orwet coating (e.g., by comma coating or other types of roll-to-rollliquid coaters). A liquid dielectric could either be dried or cured toform a solid dielectric layer. Curing could be thermally-activated,moisture-activated, microwave-activated, or UV light-activated. Thedielectric layer can be cured or dried in-line as the layer is beingformed. In one embodiment, the dielectric film is formed by direct writetechniques (e.g., inkjet printing, digital printing, pen/stylus baseddeposition, optical or laser assisted deposition, syringe dispense,Xerographic printing, and the like). A direct write device (e.g., anink-jetting machine) may be provided and controlled by a computerprogram or machine that can control the selective deposition of thedielectric material. In one embodiment, the deposition of the functionalblocks by FSA and the formation of the dielectric film are done on thesame machine. In one embodiment, the dielectric film is formed over thefunctional blocks using the continuously moving web (the substrate 120).In one embodiment, the dielectric layer is selectively applied in onlyspecific locations, e.g., on the substrate areas with the functionalblocks and/or over certain area of the functional blocks. In theembodiment where the dielectric layer is selectively deposited, it mayassist in adhering the functional blocks in the recesses, and it may notbe necessary to form vias.

In one embodiment, to form the vias that can expose the contact pads onthe functional blocks, the substrate with the functional blocksdeposited therein is inspected by an optical scanner (not shown) priorto via formation to determine the location of the contact pads on thefunctional blocks that need vias over them. Preferably, this inspectionis done in-line with the via formation process, and the image analysisis done automatically by a computerized vision system (not shown), andthe results are sent directly to the via formation apparatus to selectwhich vias to form. As a result, vias are only formed in the dielectricabove the contact pads of the functional blocks.

The via opening(s) in the dielectric layer can be opened either beforeor after the dielectric film is placed on the functional blocks-filledsubstrate. The openings could be punched prior to dielectric layerapplication to the filled substrate web, or could be created by etching,photolithography, or by laser via drilling after the dielectric film isdeposited over the substrate. Laser drilling can be used to form thevias, which could be accomplished with either a UV, visible, or IRlaser. In one embodiment, a UV-laser is used to form the via openings inthe dielectric layer. Laser via drilling can be accomplished with eithera long pulse of energy, or a series of short pulses. In the case of aseries of short pulses, the position of the laser can be adjusted sothat one or more pulses occur in different positions within each via. Avia with a wider, non-circular opening can be created by laser drillingpartially through the dielectric film. The vias could also beself-forming in liquid systems that, after application to the functionalblock-filled substrate web, selectively de-wet off of the contact padson the functional blocks.

In one embodiment, the substrate 120 is held flat on a chuck, scanned,and then drilled to form a group of vias prior to indexing forward sothat another section of the substrate 120 can be treated. The scanning(e.g., optical scanning) and the via drilling may also occur on a movingweb when the substrate 120 is moving or moving continuously.

Conductive interconnects are then formed into and on the dielectricfilm. In one embodiment, the conductive interconnects are formed in acontinuously moving web. The conductive interconnects also fill the viasto allow electrical interconnection to the functional blocks. In oneembodiment, the vias are filled with a conductive material to form viaconductors. A pad conductor is then formed on the dielectric film tointerconnect to each via conductor. Each pad conductor and via conductorcan form a conductive interconnect and/or be made of the same materialsand in one process in many embodiments. The via conductors and the padconductors can be formed on a continuously moving web of the substrateroll 120. The planarization and the conductive interconnect formationare generally shown at 132 in FIG. 8.

In one embodiment, residues in the vias are removed prior to filling thevias. The cleaning step can be accomplished by treatment with adetergent cleaning system, a water rinse system, an oxygen plasmasystem, a vacuum plasma system, an atmospheric plasma system, a brushscrubbing system, or a sand or solid carbon dioxide blasting system. Thevia can be filled with the conductive material using sputtering orevaporation across the entire substrate, followed by lithographicpatterning of a mask and subsequent etching, to leave metal only aroundand in the via. The conductive material in the vias can be formed by anyof a variety of conductive composite printing methods, including screenprinting or gravure printing. In some embodiments, the conductivematerial in the vias is formed by a local printing method such as directwrite deposition. The conductive material is typically thermally-curedor UV-cured, or cured by air-drying. In other embodiments, theconductive materials in the vias are formed by a direct-write or anadaptive-wiring process (e.g. ink-jet printing, digital printing,pen/stylus based deposition, optical or laser assisted deposition,syringe dispense, Xerographic printing, and the like). In the case ofdirect-write or adaptive wiring, the positioning of each individualconductive material in each via can be controlled by a machine visionsystem analogous to the system that is used to locate the position onthe dielectric layer to form the vias openings.

Similar methods for forming the conductive material in the vias can beused to form the conductive interconnects on the dielectric film (alsoreferred to as pad conductors) that couple to the via conductors. Insome embodiments, the same conductive material is used to fill the viaas well as forming the interconnects on the dielectric layer aspreviously described. In one embodiment, the interconnects are formed bymetal sputtering or evaporation across the entire substrate 120,followed by lithographic patterning of a mask and subsequent etching, toleave metal only in the preferred pad conductor shape and in contactwith the conductor in the vias. The via conductors and the padconductors can be formed in one step as forming one continuousconductor.

The via conductors and the pad conductors can be made of one or more ofthe following: conductive particles dispersed in a nonconductive matrix(e.g., silver ink, sputtered/evaporated metal, conductive carboncomposites, carbon nanotubes) or inorganic nanowires dispersed in anonconductive matrix (e.g., a thermoplastic polymer, a thermosetpolymer, or a B-staged thermoset polymer), or any of these materialscombined with metallic nanoparticles. The via conductors and the padconductors' materials are prepared so that they can be deposited on acontinuously moving web.

A station 138 may be provided to inspect and/or test the functionalityof the assemblies. The assemblies are tested for functionality such thatknown-bad assemblies can be marked, so that they can be actively avoidedin future process steps. Known-good assemblies can be marked, so thatthey can be actively selected in future process steps. The mark can bean ink mark, ink jet marking, stamping, or a laser burn mark, or anyother mark that is detectable by either a human eye, a sensor, or both.In one embodiment, the marking is a laser marking and is applied to theparticular pad conductors so as to leave a black mark on the padconductors. In one embodiment, the tests are done by coupling theelectromagnetic energy from the tester to the assemblies. The couplingcan be resistive, inductive, or capacitive, or a combination thereof,using contact methods (e.g., direct electrical contact), non-contactmethods, or a combination thereof. Even in a densely-packed set ofstraps, individual assemblies can be tested without undue interferencefrom neighboring devices. In one embodiment, individual assemblies aretested based on a predefined set of criteria or parameters, forinstance, one assembly out of every 10 assemblies formed on a web istested. Other criteria or parameters are of course possible. After thetesting, the substrate 120 is further advanced to another set of supportmembers 134 for subsequent processing or lamination processes. In oneembodiment, an additional conductive trace is formed on the substrate120 to interconnect to the conductive interconnect. The conductive tracemay be an antenna trace or other conductive element for an externalelectrical element. The conductive trace may be formed by a convenientmethod such as printing, laminating, deposition, etc. A roll of material136 is shown to laminate to the substrate 120. The material from theroll 136 can be a cover a jacket or other suitable material forsubsequent processing or for completing the assemblies. In oneembodiment, the roll 136 is a device substrate having formed thereon aconductor pattern. The substrate 120 having the functional blocksdeposited therein and other elements formed therein/thereon is attachedto the substrate from the roll 136 such that the conductiveinterconnects are coupled to the conductor pattern. In one embodiment,the substrate assemblies after processed as shown in FIG. 8 aresingulated or cut to form individual assemblies such as assemblies 200or 400.

FIG. 9 illustrates another overall process of fabricating an electronicassembly in according to embodiments of the present invention. Thisprocess is similar to the one described in FIG. 8 except that therecessed regions on the substrate 120 are formed using a step-and-repeatprocess. The process in FIG. 9 can be a continuous process asillustrated or can be separated into one or more separate orsub-processes. The process in FIG. 9 can take place on one machine or onseveral machines.

Similar to FIG. 8, in FIG. 9, a roll of substrate 120 is provided. Thesubstrate 120 material is flexible. The substrate 120 may besprocket-hole-punched to assist in web handling. The substrate 120 isadvanced from the roll 117 to a station 119 that forms a plurality ofrecessed regions as previously described. In one embodiment, a verticalhot press 121 is provided with a template such as the template 51previously described for the formation of the recessed regions. Thesubstrate 120 is advanced through a set of support members 122 as therecessed regions are created into the substrate 120. A first slurry 124containing a plurality of functional blocks is dispensed onto thesubstrate 120. A second slurry 126 containing a plurality of functionalblocks may also be used to dispense onto the substrate 120. Excessslurry is collected in a container 128 and is recycled. The functionalblocks fall into the recessed regions in the substrate 120. Thesubstrate 120 is advanced to another set of support members 130. Aninspection station (not shown) may be provided to check for emptyrecessed regions or for improperly filled recessed regions. There mayalso be clearing device (not shown) to remove excess functional blocksor blocks not completely seated or deposited into the recessed regionsoff the substrate 120. A vibration device (not shown) may be coupled tothe substrate 120 and/or to the slurry dispensing device to facilitatethe distribution and/or deposition of the functional blocks. An exampleof a dispensing device that can work with vibrational assistance todispense the functional blocks is described in U.S. patent applicationSer. No. 10/086,491, entitled “Method and Apparatus For Moving Blocks”filed on Feb. 28, 2002, which is hereby incorporated by reference in itsentirety. In one embodiment, the functional blocks are deposited ontothe substrate using methods described in U.S. patent application Ser.No. 10/086,491.

Continuing with FIG. 9, and generally shown at 132 a planarization (ordielectric) layer is then deposited or laminated onto the substrate 120similar to previously discussed. Vias are formed in the dielectric film.Conductive interconnects are then formed on the dielectric film. Theconductive interconnects also fill the vias to allow electricalinterconnection to the functional blocks. In one embodiment, the viasare filled with a conductive material referred to as a via conductor. Apad conductor is then formed on the dielectric film to interconnect tothe via conductor. The pad conductor and the via conductor can form theconductive interconnects in many embodiments. The planarization and theconductive interconnect formation is generally shown at 132 in FIG. 9. Astation 138 may be provided to inspect and/or test the functionality ofthe assemblies as previously described. After the testing, the substrate120 is further advanced to another set of support members 134 forsubsequent processing or lamination processed. In one embodiment, aconductive trace is formed on the substrate 120 to interconnect to theconductive interconnect. The conductive trace may be an antenna trace orother conductive element. The conductive trace may be formed by aconvenient method such as printing, laminating, deposition, etc. A rollof material 136 is shown to laminate to the substrate 120. The materialcan be a cover a jacket or other suitable material to complete theassemblies. In one embodiment, the roll 136 is a device substrate havingformed thereon a conductor pattern. The substrate 120 with thefunctional blocks deposited therein and other elements formedtherein/thereon is attached to the substrate roll 136 such that theconductive interconnects are coupled to the conductor pattern. In oneembodiment, the substrate assemblies after processed as shown in FIG. 9are singulated or cut to form individual assemblies such as assemblies200 or 400.

In one embodiment, a roll of substrate with recessed regions formedtherein is formed by joining several sheets of materials together asillustrated in FIGS. 10-11. In many instances, a number of certainpredefined sections of the substrate are formed, for example, using atemplate such as the template 51 previously described. These sections ofsubstrate with the recessed regions formed therein are then spliced,welded, or otherwise attached to one another to form a long section or aroll of substrate. As shown in FIG. 10, frame 1002, 1004, and 1006 areformed. The frame 1002 is formed with a piece of substrate 1008 with apredetermined dimension. Likewise, the frame 1004 are 1006 are alsoformed with a piece of substrate 1010 and 1012, respectively. Recessedregions 1014 are created into each of the substrates 1008, 1010, and1012. Then, as shown in FIG. 11, the frames 1002, 1004, and 1006 arewelded together to form a long piece of substrate 1020 or a roll ofsubstrate 1020. Between each two frames, a step-change is formed. Forexample, between the frame 1002 and 1004 is a step-change 1022 andbetween the frame 1004 and 1006 is a step-change 1024. In the presentembodiment, the frames can be attached together such that thestep-changes are uniform and consistent from one frame to the next. Thepresent embodiment allows one to control the direction of thestep-changes for the benefits previously discussed.

After the substrate 1020 is formed, the substrate 1020 may be rolled upinto a roll form and placed on a web line processing similar to thoseprocesses described in FIGS. 8-9 to deposit the functional blocks andform other elements on the substrate. As can be seen in FIG. 12, thesubstrate 1020 is advanced from a roller 117 through a set of supportmembers 122. A first slurry 124 containing a plurality of functionalblocks is dispensed onto the substrate 1020. A second slurry 126containing a plurality of functional blocks may also be used to dispenseonto the substrate 1020. Excess slurry is collected in a container 128and is recycled. The functional blocks fall into the recessed regions inthe substrate 1020. The substrate 1020 is advanced to another set ofsupport members 130. An inspection station (not shown) may be providedto check for empty recessed regions or for improperly filled recessedregions. There may also be a clearing device (not shown) to removeexcess functional blocks or blocks not completely seated or depositedinto the recessed regions off the substrate 1020. A vibration device(not shown) may be coupled to the substrate 1020 and/or to the slurrydispensing device to facilitate the distribution and/or deposition ofthe functional blocks. An example of a dispensing device that can workwith vibrational assistance to dispense the functional blocks isdescribed in U.S. patent application Ser. No. 10/086,491, entitled“Method and Apparatus For Moving Blocks” filed on Feb. 28, 2002, whichis hereby incorporated in its entirety. In one embodiment, thefunctional blocks are deposited onto the substrate using methodsdescribed in U.S. patent application Ser. No. 10/086,491.

A planarization (or dielectric) layer is then deposited or laminatedonto the substrate 1020. Vias are formed in the dielectric film.Conductive interconnects are then formed on the dielectric film. Theconductive interconnects also fill the vias to allow electricalinterconnection to the functional blocks. In one embodiment, the viasare filled with a conductive material referred to as a via conductor. Apad conductor is then formed on the dielectric film to interconnect tothe via conductor. The pad conductor and the via conductor can form theconductive interconnects in many embodiments. The planarization and theconductive interconnect formation is generally shown at 132 in FIG. 12.A station 138 may be provided to inspect and/or test the functionalityof the assemblies as previously described. The substrate 1020 is furtheradvanced to another set of support members 134 for subsequent processingor lamination processed. In one embodiment, a conductive trace is formedon the substrate 1020 to interconnect to the conductive interconnect.The conductive trace may be an antenna trace or other conductiveelement. The conductive trace may be formed by a convenient method suchas printing, laminating, deposition, methods of direct writing, etc. Aroll of material 136 is shown to laminate to the substrate 1020. Thematerial can be a cover, a jacket, or other suitable material tocomplete the assemblies. In one embodiment, the roll 136 is a devicesubstrate having formed thereon a conductor pattern. The substrate 1020having the functional blocks deposited therein and other elements formedtherein/thereon is attached to the roll 136 such that the conductiveinterconnects are coupled to the conductor pattern. In one embodiment,the substrate assemblies after processed as shown in FIG. 12 aresingulated or cut to form individual assemblies such as assemblies 200or 400. Similar to previously discussed, the process illustrated in FIG.12 can occur on one machine or on several machines. Additionally, theprocess illustrated in FIG. 12 can also be separated into one or moresub-processes as opposed to be continuous as shown in this figure.

FIG. 13 illustrates an exemplary method 1300 of forming an electronicassembly in accordance to embodiments of the present invention. At box1302, a plurality of recessed regions is formed on a substrate. At box1304, a plurality of functional blocks is deposited into the recessedregions. Each of the functional blocks is deposited in one of therecessed regions. A substantial amount of the plurality of functionalblocks is recessed below a top surface of said substrate. Substantialamount is defined by (1) less than 10% of the plurality of thefunctional blocks protrudes above the top surface of the substrate, (2)less than 1% of the plurality of the functional blocks protrudes abovethe top surface of the substrate, (3) more than 90% of the plurality ofthe functional blocks are recessed below the top surface of thesubstrate, or (4) more than 99% of the plurality of the functionalblocks are recessed below the top surface of the substrate.

In one embodiment, each of the recessed regions has a first width-depthaspect ratio and each of the functional blocks has a second width-depthaspect ratio. The first width-depth aspect ratio substantially matchesthe second width-depth aspect ratio. The first width-depth aspect ratiois one of equal to or less than 10.5:1, or preferably equal to or lessthan 7.5:1.

A step-and-repeat process can be used to form the recessed regions aspreviously described. In such process, one area of the substrate isformed with the plurality of recessed regions at a time. In oneembodiment, the material web that is used for the substrate is passedunder a vertical hot press wherein a mold is attached thereto to formthe plurality of recessed regions. At least one area of the substrate isformed with the plurality of recessed regions each time the substratepasses the vertical hot press.

In another embodiment, a continuous process is used to form the recessedregions as previously described. In one embodiment, a material that isused to form the substrate is extruded to form the substrate and whileextruding, the plurality of recessed regions is formed into thesubstrate. In the present embodiment, materials used to form or extrudethe substrate such as polymer pellets are heated and extruded to form amelted film. A roller or a template with features provided to form therecessed regions is brought into contact with the melted film. Therecessed regions are thus formed into the substrate while it is beingextruded.

At box 1306, a dielectric layer is formed over the functional blocksand/or the substrate. At box 1308, vias are created into the dielectriclayer to allow contact to the functional blocks or the contact pads onthe functional blocks as previously described. At box 1310, conductiveinterconnects are formed in the vias and over the dielectric layer aspreviously described to form via conductors and pad conductors.

FIGS. 14A-14B illustrate an exemplary method 1400 of forming anelectronic assembly in accordance to embodiments of the presentinvention. The method 1400 is similar to the method 1300 described abovewith the addition of using copies of an embossing mold to form therecessed regions. At box 1402, a master mold is formed. The master moldcomprises an etched silicon wafer and/or a diamond turning machinedmetal plate. At box 1404, a mother copy mold from the master mold isformed. In the case of a female silicon wafer master, which hasreceptors rather than embossing features, a father copy mold is madefirst, and the mother copy mold is made from the father copy mold. Atbox 1406, a stamper copy mold from the mother copy mold is formed. Atbox 1408, the stamper copy mold is used to form each of the plurality ofrecessed regions on a substrate. Each of said master mold, the mothercopy mold, the father copy mold and the stamper copy mold comprisesfeature dimensions provided for each of the plurality of recessedregions. The feature dimensions for each of the plurality of recessedregions are about 0.5-1.0% larger than a desired corresponding featureof each of the plurality of recessed regions. Typically each of theforming steps involves electroforming a nickel plate or shim, but otherforming methods, such as molding or casting of metal or polymer are alsopossible.

In another embodiment, a master mold negative is formed from the mastermold. A stamper copy mold or generated is then formed from the mastermold negative. At box 1408, the stamper copy mold formed form the mastermold negative is used to form each of the plurality of recessed regions.

In another embodiment, one or more stamper copy molds are formed. Eachof the stamper copy mold comprises at least one feature for forming oneof the plurality of recessed regions. The stamper copy molds are thenwelded together to form a mold having an array of the features forforming an array of the recessed regions. The features are then used toform an array of the plurality of recessed regions on the substrate.

At box 1410, a plurality of functional blocks is deposited into therecessed regions. Each of the functional blocks is deposited in one ofthe recessed regions. A substantial amount of the plurality offunctional blocks is recessed below a top surface of said substrate.Substantial amount is defined by (1) less than 10% of the plurality ofthe functional blocks protrudes above the top surface of the substrate,(2) less than 1% of the plurality of the functional blocks protrudesabove the top surface of the substrate, (3) more than 90% of theplurality of the functional blocks are recessed below the top surface ofthe substrate, or (4) more than 99% of the plurality of the functionalblocks are recessed below the top surface of the substrate.

At box 1412, a dielectric layer is formed over the functional blocksand/or the substrate. At box 1414, vias are created into the dielectriclayer to allow contact to the functional blocks or the contact pads onthe functional blocks as previously described. At box 1416, conductiveinterconnects are formed in the vias and over the dielectric layer aspreviously described.

FIG. 15 illustrates another exemplary method 1500 of forming anelectronic assembly in accordance to embodiments of the presentinvention. At box 1502, a plurality of sheets of substrates is provided.The sheets comprise of materials that are used for the substrates of aplurality of electronic assemblies. The sheets can be comprised ofdifferent, same, or similar materials from one another. The sheets canbe differently treated or similarly treated from one another and/orintended for same of different devices. At box 1504, an array of therecessed regions is formed on each sheet. The sheets may all have sametypes of recessed regions or different types of recessed regions formedtherein. At box 1506, the sheets are joined or welded together to form acontinuous web of the substrate having formed therein the plurality ofrecessed regions.

In one embodiment, each of the recessed regions has a first width-depthaspect ratio and each of the functional blocks has a second width-depthaspect ratio. The first width-depth aspect ratio substantially matchesthe second width-depth aspect ratio. The first width-depth aspect ratiois one of equal to or less than 10.5:1, and optimally equal to or lessthan 7.5:1.

In one embodiment, a step-and-repeat process using an embossing mold isused to form the recessed regions as previously described. In thepresent embodiment, each sheet is formed with the plurality of recessedregions at a time. After the recessed regions are formed, the sheets arejoined together.

In an alternative embodiment, the sheets are joined together prior tothe formation of the recessed regions. Previous methods discussed can beused to form the recessed regions in the joined sheets.

As previously mentioned, when the sheets are joined together, each sheetmay be referred to as a frame. Between two frames, there may be astep-change and that one step-change is consistent in direction ofchange with another step-change from one frame to the next frame (e.g.,FIGS. 7G-7H).

At box 1508, a plurality of functional blocks is deposited into therecessed regions. Each of the functional blocks is deposited in one ofthe recessed regions. A substantial amount of the plurality offunctional blocks is recessed below a top surface of said substrate.Substantial amount is defined by any (1) less than 10% of the pluralityof the functional blocks protrudes above the top surface of thesubstrate, (2) less than 1% of the plurality of the functional blocksprotrudes above the top surface of the substrate, (3) more than 90% ofthe plurality of the functional blocks are recessed below the topsurface of the substrate, or (4) more than 99% of the plurality of thefunctional blocks are recessed below the top surface of the substrate.

At box 1510, a dielectric layer is formed over the functional blocksand/or the substrate. At box 1512, vias are created into the dielectriclayer to allow contact to the functional blocks or the contact pads onthe functional blocks as previously described. At box 1514, conductiveinterconnects are formed in the vias and over the dielectric layer aspreviously described.

Many embodiments of the present invention utilize selective depositionof a dielectric layer, a conductive interconnect, or other layer to forma strap assembly. Local printing techniques can be used in variousembodiments to effectuate such selective deposition. An example of alocal printing technique is direct write, which includes ink-jetprinting, piezoelectric jet printing, acoustic jet printing, stencilprinting, digital printing, pen/stylus based deposition, optical orlaser assisted deposition, syringe dispense, Xerographic printing, andthe like. A direct write technique is a deposition technique thatenables simultaneous deposition and patterning of a material onto asubstrate. In one embodiment, ink-jet printing is used with apiezoelectric print head. A direct write system typically employs aguiding system that allows for precise control of where a particularmaterial is to be printed.

Using direct write method to form one or more part of the various layersor components of a strap assembly leads to high throughput since directwrite uses only a small amount of material (e.g., conductive ink ordielectric material) to form the layers or components. Another factorinfluencing the overall cost of a strap is the cost of substrate ontowhich strap is made. Lower cost material may have high distortion.Screen-printing process with a fixed scale for the screen may not beable to accommodate this difference in scaling. An ink jet system candynamically correct for this scaling difference. Additionally, even ifthe deposition process and material can be designed for the particularscreen printing machine, it will have low throughput as the system mustalign itself and printing speed must be lowered to meet the highaccuracy requirements. Also, high-resolution screen and material neededto meet high accuracy requirements for a screen-printing process aresignificantly more expensive than otherwise.

In one embodiment, a direct write technique is used to deposit adielectric material where it is needed on a functional block that isembedded in a substrate. The same direct write technique can be used todeposit the dielectric material where it is needed on the substrate. Inone embodiment, the direct write technique is used to deposits thedielectric material over selected areas of the functional block and thesubstrate which could be used to bridge or cover a gap from thefunctional block to the substrate or to protect sensitive area on thefunctional block. Using the direct write technique to form thedielectric layer where needed reduces fabrication cost and materialcost. A guiding system accompanies the direct write process to controlwhere to form the dielectric material.

In one embodiment, a direct write technique is used to form a conductiveinterconnect to and from the functional block. One advantage of using adirect write technique to form the conductive interconnect is thatdirect write technique can employ an accurate registration andresolution control system and such registration and resolution controlsystem can look at the substrate and dynamically correct for any scalingerror and print a conductive trace away from any contact pads of thefunctional block. Screen-printing or other printing methods can also beused to form some parts of the conductive interconnect. For instance,the direct write technique can be used to print a via conductorconnecting to a contact pad on the functional block and a conductor leadthat connects from the via conductor and away from the contact pad;then, a screen-printing process can be used to print a pad conductorthat connect to the lead conductor. External interconnections can beconnected to this pad conductor as previously discussed.

FIG. 16 illustrates an exemplary method 1600 of forming a device inaccordance to embodiments of the present invention. Method 1600incorporates a direct write technique into forming a strap assembly. Atbox 1602, functional blocks are deposited into recessed receptor sitesprovided on a strap (first) substrate. (See, for example, FIG. 18B forblocks 1804 being deposited in a strap substrate 1802). At box 1604,areas that need dielectric material to be formed thereon are determined.For example, areas proximate contact pads on the functional blocks orareas that need sealing or bridging from the functional blocks to thesubstrate surface. At box 1606, the dielectric material is depositedwhere necessary. (See, for example, FIG. 18B for dielectric material1806 being selectively deposited where necessary). In one embodiment, adirect write process (e.g., ink-jetting) is used to deposit thedielectric material. At box 1608, vias are formed into the dielectricmaterial where necessary to expose contact pads on the functionalblocks. (See, for example, FIG. 18B for vias 1808 being formed into thedielectric material 1806). At box 1610, via conductors are formed in thevias to establish connection to the contact pads. At box 1612, conductorleads are formed using a direct write method. The conductor leads areextensions from the via conductors. At box 1614, pad conductors areformed using any suitable method such as screen-printing or directwrite. The pad conductors may have any of the configurations previouslydiscussed (e.g., bow-tie like). The pad conductors allows for easy andconvenient electrical interconnection to the conductor leads, to the viaconductors, and to the contact pads. At box 1616, strap assemblies areformed. Other processes not listed herein may be necessary to completethe formation of the strap assemblies. Components and layers of thestrap assemblies (e.g., blocks, dielectric layers, and interconnectionscan be formed while the strap substrate is on a continuous web or acontinuously moving web, similar to previously discussed.

Parallel to the strap assemblies' forming process, a device substrate isprovided. The device substrate can also be a continuous web aspreviously mentioned. At box 1620, a conductor pattern (e.g., an antennaor elements of an antenna) is formed on a device (second) substrate. Anysuitable method can be used to form the conductor pattern. The devicesubstrate may also be provided with the conductor pattern already formedtherein (e.g., by a supplier). (See, for example, FIG. 18B for a devicesubstrate 1820 with a conductor pattern 1822). The device substrate maybe supplied or provided in a roll format. At box 1622, one or more strapassemblies are attached to the device substrate in a way that the padconductors are contacting the conductor pattern or part of the conductorpattern (see, for example, FIG. 18B). A conductive adhesive or connectormay be used to interconnect the pad conductors to the conductor patternon the device substrate. An example of a device that can be formed usingthe method 1600 is an RFID tag.

FIG. 17 illustrates an exemplary method 1700 of forming a device inaccordance to embodiments of the present invention. Method 1700 issimilar to method 1600 except that there a lead conductor is not formedbetween the via conductor and the pad conductor. At box 1702, functionalblocks are deposited into recessed receptor sites provided on a strap(first) substrate. (See, for example, FIG. 18B for blocks 1804 beingdeposited in a strap substrate 1802). At box 1704, areas that needdielectric material to be formed thereon are determined. At box 1706, adielectric material is deposited where necessary. (See, for example,FIG. 18B for dielectric material 1806 being selectively deposited wherenecessary). In one embodiment, a direct write process (e.g.,ink-jetting) is used to deposit the dielectric material. At box 1708,vias are formed into the dielectric material where necessary to exposecontact pads on the functional blocks. (See, for example, FIG. 18B forvias 1808 being formed into the dielectric material 1806). At box 1710,via conductors are formed in the vias to establish connection to thecontact pads. At box 1712, pad conductors are formed using a directwrite deposition. The pad conductors may have any of the configurationspreviously discussed (e.g., bow-tie like). The pad conductors allows foreasy and convenient electrical interconnection to the via conductors andto the contact pads. At box 1714, strap assemblies are formed. Otherprocesses not listed herein may be necessary to complete the formationof the strap assemblies. Components and layers of the strap assemblies(e.g., blocks, dielectric layers, and interconnections can be formedwhile the strap substrate is on a continuous web or on a continuouslymoving we, similar to previously discussed.

Parallel to the strap assemblies' forming process, a device substrate isprovided. The device substrate can also be a continuously web aspreviously mentioned. At box 1720, a conductor pattern (e.g., an antennaor elements of an antenna) is formed on a device (second) substrate. Anysuitable method can be used to form the conductor pattern. The devicesubstrate may also be provided with the conductor pattern already formedtherein (e.g., by a supplier). (See, for example, FIG. 18B for a devicesubstrate 1820 with a conductor pattern 1822). The device substrate maybe supplied or provided in a roll format. At box 1722, one or more strapassemblies are attached to the device substrate in a way that the padconductors are contacting the conductor pattern or part of the conductorpattern (see, for example, FIG. 18B). A conductive adhesive or connectormay be used to interconnect the pad conductors to the conductor patternon the device substrate. An example of a device that can be formed usingthe method 1700 is an RFID tag.

FIG. 18A illustrates an exemplary method 1800 of forming a device inaccordance to embodiments of the present invention. Method 1800 issimilar to methods 1600 and 1700 except that there a lead conductor isnot formed and that an interconnect is formed that acts as both a viaconductor and a pad conductor. At box 1860, functional blocks aredeposited into recessed receptor sites provided on a strap (first)substrate. (See, for example, FIG. 18B for blocks 1804 being depositedin a strap substrate 1802). At box 1862, areas that need dielectricmaterial to be formed thereon are determined. At box 1864, a dielectricmaterial is deposited where necessary. (See, for example, FIG. 18B fordielectric material 1806 being selectively deposited where necessary).In one embodiment, a direct write process (e.g., ink-jetting) is used todeposit the dielectric material. At box 1866, electrical interconnectsare formed to the functional blocks using a direct write method. At box1868, strap assemblies are formed. Other processes not listed herein maybe necessary to complete the formation of the strap assemblies.Components and layers of the strap assemblies (e.g., blocks, dielectriclayers, and interconnections can be formed while the strap substrate ison a continuous web or on a continuously moving web, similar topreviously discussed.

Parallel to the strap assemblies' forming process, a device substrate isprovided. The device substrate can also be a continuously web aspreviously mentioned. At box 1870, a conductor pattern (e.g., an antennaor elements of an antenna) is formed on a device (second) substrate. Anysuitable method can be used to form the conductor pattern. The devicesubstrate may also be provided with the conductor pattern already formedtherein (e.g., by a supplier). (See, for example, FIG. 18B for a devicesubstrate 1820 with a conductor pattern 1822). The device substrate maybe supplied or provided in a roll format. At box 1872, one or more strapassemblies are attached to the device substrate in a way that the padconductors are contacting the conductor pattern or part of the conductorpattern (see, for example, FIG. 18B). A conductive adhesive or connectormay be used to interconnect the pad conductors to the conductor patternon the device substrate. An example of a device that can be formed usingthe method 1800 is an RFID tag.

FIG. 19A illustrates an exemplary method 1900 of forming a device inaccordance to embodiments of the present invention. At box 1902,functional blocks are deposited into recessed receptor sites provided ona strap (first) substrate using a Fluidic Self-Assembly process. Thestrap substrate is provided on a web substrate or is part of a websubstrate. (See, for example, FIG. 19B for blocks 1960 being depositedin a strap substrate 1962). At box 1904, vias conductors are formed toconnect directly to contact pads on the functional blocks using a directwrite method (e.g., ink-jetting). (See, for example, FIG. 19B for blocksvia conductors 1964 being direct written on contact pads 1966 of thefunctional blocks 1960). At box 1906, a dielectric layer is formedaround each via conductor and optionally, over each predetermined areaof each functional block as well as the strap substrate using similardirect write method. (See, for example, FIG. 19B for dielectric layer1968 being form around the via conductor 1966). As before, thedielectric material is deposited where necessary. At box 1908, padconductors are formed to connect to the via conductors. A direct writemethod (or other suitable method) can be used to form the padconductors. (See, for example, FIG. 19C for pad conductors 1970 beingformed and connected to the via conductor 1966). The pad conductors mayhave any of the configurations previously discussed (e.g., bow-tielike). At box 1910, strap assemblies are formed. Other processes notlisted herein may be necessary to complete the formation of the strapassemblies. The process of method 1900 can all occur while the websubstrate is continuously moving from one station to another stationwhere each station performs a particular process, e.g., FSA, directwrite conductive material, or direct write dielectric material.

In one embodiment, at box 1912, the web material with the strapassemblies formed thereon is singulated to form individual strapassemblies. In other words, individual assemblies are singulated,sliced, cut, or otherwise separated from one another or from the websubstrate. Parallel to the strap assemblies' forming process, asubstrate device is provided. At box 1916, a conductor pattern (e.g., anantenna or elements of an antenna) is formed on a device (second)substrate. Any suitable method can be used to form the conductorpattern. The device substrate may also be provided with the conductorpattern already formed therein (e.g., by a supplier) as previouslydescribed. The device substrate may also be supplied in the form of aweb roll. Also at box 1916, the strap assemblies are attached to thedevice substrate in a way that the pad conductors are contacting theconductor pattern or part of the conductor pattern as previouslydescribed. A conductive adhesive or connector may be used tointerconnect the pad conductors to the conductor pattern on the devicesubstrate. An example of a device that can be formed using the method1900 is an RFID tag. A plurality of strap assemblies or just one strapassembly may be attached to one individual device substrate depending onapplications. Several strap assemblies may be attached to one individualdevice substrate and then singulated to form individual final deviceseach having a strap assembly and a device substrate attached to oneanother.

In an alternative embodiment, at box 1914, parallel to the strapassemblies' forming process, a substrate device is provided. At box1914, a conductor pattern (e.g., an antenna or elements of an antenna)is formed on a device (second) substrate. Any suitable method can beused to form the conductor pattern. The device substrate may also beprovided with the conductor pattern already formed therein (e.g., by asupplier) as previously described. The device substrate may be suppliedin the form of a web roll. The strap assemblies are attached to thedevice substrate in a way that the pad conductors are contacting theconductor pattern or part of the conductor pattern as previouslydescribed. A conductive adhesive or connector may be used tointerconnect the pad conductors to the conductor pattern on the devicesubstrate. At box 1918, the web material with the strap assembliesattached to the device substrate is singulated to form individual finaldevices. In other words, individual devices are singulated, sliced, cut,or otherwise separated from one another or from the web substrate. Aplurality of strap assemblies or just one strap assembly may be attachedto one individual final device depending on applications. An example ofa device that can be formed using the method 1900 is an RFID tag.

FIGS. 20-23 illustrates how layers and components are selectively formedon a functional block and optionally, a substrate that the functionalblock is deposited therein. FIG. 20 illustrates a functional block 2004being deposited into a receptor site 2002 formed on a substrate 2001 aspreviously discussed. The functional block 2004 includes one or morecontact pads 2006 to allow for electrical interconnections to thefunctional block 2004. As previously discussed, in one embodiment, thefunctional block 2004 is recessed below a surface of the substrate 2000.A lead conductor 2010 is formed that connects to the contact pads andextends away from the contact pads 2006. A direct write technique (e.g.,ink jetting) is used to form the lead conductor 2006, in one embodiment.In one embodiment, the lead conductor 2006 connects to a pad conductor2008 formed on the substrate 2002. Thus, a direct write technique isused to form the lead conductors 2006 that can re-route and expand thecontact pads 2006 of the functional blocks 2004. Although not shown inFIG. 20, a dielectric layer may be selectively formed over thefunctional blocks using a suitable method such as direct write. Then,the pad conductor 2008 is formed on the dielectric layer and connectedto the lead conductor 2010. A strap assembly 2000 is formed when allproper interconnections are formed for the functional block 2004.

In FIG. 21, the strap assembly 2000 is attached or coupled to anelectrical or conductor pattern 2012 that may be provided on a secondsubstrate or a device substrate. As shown in this figure, a conductivematerial 2008 is formed to make the electrical connection between thestrap assembly 2000 and the electrical pattern 2012. The conductivematerial 2008 can be part of the pad conductor 2006 formed in the strapassembly. The electrical pattern 2012 can be parts of an antenna or theantenna itself.

FIGS. 22-24 illustrate an example of forming a strap assembly thatincludes using a direct write technique and coupling the strap assemblyto an external device. In FIG. 22, a direct write technique, such asink-jet, laser assisted deposition, etc, is used to deposit a dielectricmaterial 3016 on the functional block 3004 where it is needed. Thedielectric material 3016 could be placed anywhere it is needed. Forexample, the dielectric material 3016 is used to bridge the gap from thefunctional block 3004 to the substrate film 3002, or to protectsensitive areas on the functional block 3004. The dielectric material3016 is also placed over areas that includes contact pads 3006 providedon the functional block 3004. Vias (not shown) may be created in thedielectric material 3016 to expose the contact pads 3006 to allow fornecessary electrical connections. Conductive material (not shown) isthen used to fill the vias (forming via conductor) and contact thecontact pads 3006 using a direct write method as previously discussed.Alternatively, the conductive material may be formed over the contactpads 3006 using a direct write method followed by the dielectricmaterial 3016 being formed around the conductive material.

In FIG. 23, lead conductors 3010 are formed to provide extensions to thecontact pads 3006 (either directly, through via conductors, or both) aspreviously discussed. A direct write method can be used to form the leadconductors 3010. Pad conductors 3008 are then formed on the substrateand optionally on portions of the dielectric material 3016. Each padconductor 3008 is interconnected to a lead conductor 3010 and in oneembodiment, the pad conductor 3008 does not reside over a surface of therespective functional block. A strap assembly 3000 is formed all thenecessary interconnections and layers are made and formed to and fromthe functional block 3004.

In one embodiment, the strap assembly 3000 is attached to a secondsubstrate or a device substrate that has a conductor pattern 3012 formedthereon (FIG. 24). For instance, the strap assembly 3000 is attached toa substrate that has an RFID antenna formed thereon to form an RFID tag.The strap assembly 3000 is attached to the second substrate such thatthe conductor pattern 3012 on the second substrate is interconnected tothe pad conductors 3008 on the strap assembly 3000. In one embodiment,the strap assembly 3000 is flipped up-side-down (like a “flip-chipformat”) onto the second substrate so that the pad conductors 3008 arefacing the conductor pattern 3012 on the device substrate. The conductorpattern 3012 can be any functional electrical pattern or feature on adevice substrate.

While many processing systems can be used to carry out certainembodiments of the present invention, FIG. 25 illustrates an exemplaryprocessing system 2500 that can be used to assemble functional blocks2504 into a strap substrate that has receptor regions configured toreceive the functional blocks as well as forming layers or components onthe substrate or the functional blocks. The system 2500 is similar tothose described in FIGS. 8-12 above with the specific incorporation of adirect write device into the system to form a certain layer of componentof the strap assembly. The system 2500 comprises a web-processing line2501 configured to and able to move a roll of substrate material 2502across one or more processing stations. A set of support rollers 2514 isprovided to facilitate the movement of the substrate material from onestation t another station. The substrate material 2502 can form or bemade to include or supports the strap substrate that the functionalblocks are to be deposited therein. The system 2500 includes a FluidicSelf-Assembly (FSA) device 2506 (at one station) configured to depositthe functional blocks 2504 into the recessed regions. In one embodiment,the substrate material 2502 is submerged under the fluid used in the FSAprocess while the blocks are being deposited. In one embodiment, aportion of the FSA device is also submerged under the fluid. Aninspection device or station 2508 may be provided to inspect thesubstrate material, e.g., for block filling, empty regions, blockfunctionality, etc.

A first direct write device 2510 is also provided (at one station) withthe system 2500. The first direct write device 2510 can be any one of anink-jetting system, a digital printing system, pen/stylus system,optical or laser assisted deposition system, syringe dispensing system,Xerographic printing system, and the like configured to formedinterconnection features (e.g., via conductors, pad conductors, or leadconductors) to and from the functional blocks.

A second direct write device 2512 is also provided with the system 2500(at one station). The second direct write device can also be any one ofan ink jetting system, a digital printing system, pen/stylus system,optical or laser assisted deposition system, syringe dispensing system,Xerographic printing system, and the like configured to formeddielectric material over a selected area upon command. More direct writedevices or stations may be included for several layers as previouslydiscussed.

In one embodiment, the system 2500 further includes a vibration device(not shown) positioned to exert a vibrational force on one or both ofthe substrate material and the slurry or fluid that is used to dispensethe functional blocks onto the substrate material. The vibration devicecan also be positioned t exert such force on the FSA dispensing device.The vibration device facilitates deposition of the functional blocks inthe receptor regions. The substrate material could also be tilt in anydirection and/or angle that further assists the deposition of thefunctional blocks. In one embodiment, a vibration device is coupled tothe FSA device 2506. In one embodiment, a vibration device is placedproximate the substrate material 2502 so that the substrate material isvibrated during deposition at the FSA station.

Other stations (not shown) could be included, for example, additionalstations are provided for the deposition of pad conductors, or othernecessary layers over the substrate material or the dielectric layer.Although not shown, the system 2500 could be made to include anembossing device configured to create the recessed regions into thesubstrate material. The embossing device would be placed ahead of theFSA device 2506 so that the embossing may take place prior to thedeposition of the functional blocks.

The processing system 2500 can include or connect to a computer system2520 that is set up to control for example, the web-processing line, theFSA device, the first direct writing device, the second direct writingdevice, the embossing device and other devices of the system 2500. Inone embodiment, the computer system 2520 may include a system controller(not shown) that can executes a system control software, which is acomputer program stored in a computer-readable medium such as a memory(not shown). Preferably, the memory is a hard disk drive, but the memorymay also be other kinds of memory known in the art. The computer programincludes sets of instructions that dictate the process of the system2500. An input/output device such as a monitor, a keyboard, and/or amouse is used to interface between a user and the computer system 2520.For instance, a set of instruction can be executed by the computersystem 2520 to move the substrate material across the web processingline for FSA, for interconnections formation, for direct writeprocessing, etc.

While the invention has been described in terms of several embodiments,those of ordinary skill in the art will recognize that the invention isnot limited to the embodiments described. The method and apparatus ofthe invention, but can be practiced with modification and alterationwithin the spirit and scope of the appended claims. The description isthus to be regarded as illustrative instead of limiting. Havingdisclosed exemplary embodiments, modifications and variations may bemade to the disclosed embodiments while remaining within the spirit andscope of the invention as defined by the appended claims.

1.-35. (canceled)
 36. A processing system to assemble functional blocksinto a strap substrate comprising: a web-processing line configured tomove a roll of substrate material across one or more processingstations; a Fluidic Self-Assembly (FSA) device configured to deposit afunctional into a recessed region formed in said substrate material; afirst direct write device configured to selectively form a dielectriclayer over said functional block and said substrate material; and asecond direct write device configured to form interconnection featuresto and from said functional block.
 37. The processing system of claim 36further comprising: a vibration device positioned to exert a vibrationalforce on one or both of said substrate material and a slurry that isdispensed via said FSA device to dispense said functional block ontosaid substrate material, said vibration device facilitates deposition ofsaid functional block.
 38. The processing system of claim 36 furthercomprising: a computer system set up to control said web-processingline, said FSA device, said first direct writing device, and said seconddirect writing device.
 39. The processing system of claim 36 furthercomprising: an embossing device configured to create said recessedregion into said substrate material.
 40. The processing system of claim39 further comprising: a computer system set up to control saidweb-processing line, said FSA device, said first direct writing device,said second direct writing device, and said embossing device.